- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/267 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups , , , , in different semiconductor regions
Patent holdings for IPC class H01L 29/267
Total number of patents in this class: 899
10-year publication summary
|
135
|
111
|
83
|
86
|
63
|
47
|
42
|
31
|
13
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46507 |
167 |
| Samsung Electronics Co., Ltd. | 151017 |
60 |
| Intel Corporation | 46576 |
58 |
| International Business Machines Corporation | 61904 |
50 |
| GLOBALFOUNDRIES U.S. Inc. | 6404 |
21 |
| Micron Technology, Inc. | 27174 |
19 |
| United Microelectronics Corp. | 4369 |
19 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1745 |
16 |
| Institute of Microelectronics, Chinese Academy of Sciences | 1411 |
14 |
| Semiconductor Energy Laboratory Co., Ltd. | 11583 |
12 |
| National Taiwan University | 1281 |
12 |
| Texas Instruments Incorporated | 19555 |
11 |
| Silanna UV Technologies Pte Ltd | 117 |
11 |
| Rfhic Corporation | 50 |
10 |
| Infineon Technologies Austria AG | 2246 |
9 |
| ASM IP Holding B.V. | 2216 |
9 |
| Toshiba Corporation | 12532 |
8 |
| Globalwafers Co., Ltd. | 712 |
8 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1034 |
8 |
| Suzhou Lekin Semiconductor Co., Ltd. | 1317 |
8 |
| Other owners | 369 |