- All sections
- H - Electricity
- H10D - Inorganic electric semiconductor devices
- H10D 80/30 - Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups , e.g. assemblies comprising integrated circuit processor chips
Patent holdings for IPC class H10D 80/30
Total number of patents in this class: 413
10-year publication summary
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0
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0
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0
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0
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0
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0
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1
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1
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89
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319
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| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 157557 |
186 |
| Micron Technology, Inc. | 27626 |
39 |
| SK Hynix Inc. | 12452 |
17 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
12 |
| Kioxia Corporation | 10805 |
9 |
| Intel Corporation | 47102 |
6 |
| Qualcomm Incorporated | 91997 |
5 |
| Rohm Co., Ltd. | 6824 |
5 |
| nD-HI Technologies Lab, Inc. | 43 |
5 |
| Huawei Technologies Co., Ltd. | 123282 |
4 |
| LG Innotek Co., Ltd. | 8453 |
4 |
| Etron Technology, Inc. | 184 |
4 |
| Monolithic Power Systems, Inc. | 437 |
4 |
| Cxmt Corporation | 419 |
4 |
| Infineon Technologies Austria AG | 2328 |
3 |
| Mediatek Inc. | 5316 |
3 |
| Sandisk Technologies Inc. | 5432 |
3 |
| Advanced Semiconductor Engineering, Inc. | 1740 |
3 |
| IMEC VZW | 1806 |
3 |
| Yangtze Memory Technologies Co., Ltd. | 3301 |
3 |
| Other owners | 91 |