- All sections
- H - Electricity
- H10D - Inorganic electric semiconductor devices
- H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
Patent holdings for IPC class H10D 84/00
Total number of patents in this class: 502
10-year publication summary
|
0
|
0
|
0
|
0
|
4
|
28
|
71
|
78
|
127
|
155
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fuji Electric Co., Ltd. | 5478 |
56 |
| Rohm Co., Ltd. | 6826 |
39 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48302 |
37 |
| Toshiba Corporation | 12560 |
27 |
| Toshiba Electronic Devices & Storage Corporation | 2322 |
21 |
| Microchip Technology Incorporated | 3323 |
19 |
| Denso Corporation | 25534 |
18 |
| Mitsubishi Electric Corporation | 48018 |
18 |
| Infineon Technologies AG | 8402 |
11 |
| Semiconductor Energy Laboratory Co., Ltd. | 11821 |
10 |
| Semiconductor Components Industries, L.L.C. | 5262 |
8 |
| Renesas Electronics Corporation | 5870 |
7 |
| Murata Manufacturing Co., Ltd. | 25744 |
7 |
| Samsung Electronics Co., Ltd. | 157719 |
6 |
| Infineon Technologies Austria AG | 2334 |
6 |
| Qualcomm Incorporated | 92196 |
5 |
| Monolithic Power Systems, Inc. | 438 |
5 |
| Nanya Technology Corporation | 2902 |
5 |
| Winbond Electronics Corp. | 1433 |
5 |
| Nuvoton Technology Corporation Japan | 727 |
5 |
| Other owners | 187 |