- All sections
- H - Electricity
- H10D - Inorganic electric semiconductor devices
- H10D 88/00 - Three-dimensional [3D] integrated devices
Patent holdings for IPC class H10D 88/00
Total number of patents in this class: 125
10-year publication summary
|
0
|
0
|
0
|
1
|
1
|
0
|
6
|
27
|
22
|
58
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42804 |
19 |
| International Business Machines Corporation | 61257 |
15 |
| Samsung Electronics Co., Ltd. | 146346 |
9 |
| Tokyo Electron Limited | 12733 |
9 |
| Micron Technology, Inc. | 26238 |
8 |
| Semiconductor Energy Laboratory Co., Ltd. | 11416 |
7 |
| Monolithic 3D Inc. | 308 |
7 |
| Soitec | 1016 |
5 |
| Intel Corporation | 47005 |
3 |
| IBM United Kingdom Limited | 4345 |
3 |
| IBM Israel-science and Technology Ltd | 145 |
3 |
| Qualcomm Incorporated | 85434 |
2 |
| Ebara Corporation | 2172 |
2 |
| IQE plc. | 114 |
2 |
| Sunrise Memory Corporation | 213 |
2 |
| Changxin Memory Technologies, Inc. | 4926 |
2 |
| Kioxia Corporation | 10293 |
2 |
| Adeia Semiconductor Inc. | 61 |
2 |
| Adeia Semiconductor Bonding Technologies Inc. | 348 |
2 |
| Applied Materials, Inc. | 18658 |
1 |
| Other owners | 20 |