- All sections
- H - Electricity
- H10N - Electric solid-state devices not otherwise provided for
- H10N 30/082 - Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
Patent holdings for IPC class H10N 30/082
Total number of patents in this class: 107
10-year publication summary
|
0
|
0
|
0
|
6
|
12
|
15
|
25
|
18
|
13
|
16
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Seiko Epson Corporation | 20337 |
11 |
| Soitec | 1110 |
9 |
| Denso Corporation | 25645 |
4 |
| Murata Manufacturing Co., Ltd. | 25809 |
4 |
| Boe Technology Group Co., Ltd. | 44409 |
4 |
| Canon Inc. | 44051 |
3 |
| Applied Materials, Inc. | 20467 |
3 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48560 |
3 |
| Sumitomo Chemical Company, Limited | 8968 |
3 |
| Lansus Technologies Inc. | 315 |
3 |
| SPTS Technologies Limited | 148 |
3 |
| Sonicmems (Zhengzhou) Technology Co.,Ltd. | 20 |
3 |
| Samsung Electronics Co., Ltd. | 158442 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 34265 |
2 |
| Aalto University Foundation | 318 |
2 |
| National Central University | 256 |
2 |
| Nihon Dempa Kogyo Co., Ltd. | 255 |
2 |
| Skyworks Solutions, Inc. | 3965 |
2 |
| eXo Imaging, Inc. | 219 |
2 |
| Qualcomm Incorporated | 92859 |
1 |
| Other owners | 39 |