Novellus Systems, Inc.

États‑Unis d’Amérique


 
Quantité totale PI 510
Rang # Quantité totale PI 2 543
Note d'activité PI 2,4/5.0    34
Rang # Activité PI 22 412
Parent Lam Research Corporation
Classe Nice dominante Machines et machines-outils

Brevets

Marques

440 1
0 0
64 0
5
 
Dernier brevet 2024 - Conformal deposition of silicon ...
Premier brevet 1977 - Silicon nitride film and method ...
Dernière marque 2009 - VORTEX
Première marque 1998 - SEQUEL EXPRESS

Filiales

10 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2023 Invention Conformal deposition of silicon carbide films. Disclosed are methods and systems for providing s...
Invention Pecvd apparatus for in-situ deposition of film stacks. An apparatus for depositing film stacks i...
2022 Invention Lipseals and contact elements for semiconductor electroplating apparatuses. Disclosed are cup ass...
Invention Tungsten feature fill with nucleation inhibition. Described herein are methods of filling featur...
Invention Films of desired composition and film properties. Provided are methods and systems for providing ...
Invention Conformal deposition of silicon carbide films. Disclosed are methods and systems for providing si...
2021 Invention Films of desired composition and film properties. Provided are methods and systems for providing...
Invention Suppression of parasitic deposition in a substrate processing system by suppressing precursor flo...
Invention Tungsten feature fill. Described herein are methods of filling features with tungsten and relate...
Invention Electroplating apparatus for tailored uniformity profile. An electroplating apparatus for electro...
2019 Invention Cleaning electroplating substrate holders using reverse current deplating. Provided are cleaning ...
Invention Method to obtain sic class of films of desired composition and film properties. Provided are met...
Invention Systems and methods for determining film thickness using dc self-bias voltage. A controller for a...
Invention Tungsten feature fill with nucleation inhibition. Described herein are methods of filling feature...
Invention Radical source design for remote plasma atomic layer deposition. A radical source for supplying r...
Invention Ultrahigh selective polysilicon etch with high throughput. Provided are methods and apparatuses ...
Invention Temperature controlled showerhead. A temperature controlled showerhead for chemical vapor deposit...
2018 Invention Pecvd apparatus for in-situ deposition of film stacks. An apparatus for depositing film stacks in...
Invention Low copper electroplating solutions for fill and defect control. Certain embodiments herein rela...
Invention Tungsten feature fill. Described herein are methods of filling features with tungsten and related...
Invention Protecting anodes from passivation in alloy plating systems. An apparatus for continuous simultan...
Invention Method and apparatuses for reducing porogen accumulation from a uv-cure chamber. Porogen accumula...
Invention Electroplating apparatus for tailored uniformity profile. Methods of electroplating metal on a su...
Invention Methods for depositing films on sensitive substrates. Methods and apparatus to form films on sens...
Invention Electroplating apparatus and process for wafer level packaging. An apparatus for continuous simul...
Invention Soft landing nanolaminates for advanced patterning. Methods for depositing nanolaminate protectiv...
2017 Invention Wetting pretreatment for enhanced damascene metal filling. Disclosed are pre-wetting apparatus de...
Invention Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating. Metho...
Invention Dynamic current distribution control apparatus and method for wafer electroplating. Methods, syst...
Invention Configuration and method of operation of an electrodeposition system for improved process stabili...
Invention Method and apparatus for electroplating semiconductor wafer when controlling cations in electroly...
Invention Methods and apparatus for wetting pretreatment for through resist metal plating. Disclosed are pr...
Invention Wafer chuck with aerodynamic design for turbulence reduction. A rotatable wafer chuck includes ch...
Invention Cross flow manifold for electroplating apparatus. The embodiments herein relate to methods and ap...
Invention Plasma activated conformal dielectric film deposition. Methods of depositing a film on a substrat...
Invention Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath...
2009 P/S Technical consultancy in relation to the production of semiconductors; designing of semiconductor...
2008 P/S Machines for manufacturing semiconductors, and parts for such machines. Computer software for int...
P/S Machines for removing light-sensitive organic polymers from semiconductor chips during the manufa...
2004 Invention Tensile dielectric films using uv curing. 2. Other dielectric capping layer film materials show s...
2000 P/S Machines for manufacturing semiconductors and parts for such machines in class 7.
1998 P/S MACHINES FOR MANUFACTURING SEMICONDUCTORS AND PARTS FOR SUCH MACHINES