- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/11 - Lapping tools
Patent holdings for IPC class B24B 37/11
Total number of patents in this class: 79
10-year publication summary
|
14
|
8
|
2
|
8
|
6
|
4
|
8
|
6
|
9
|
1
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 17987 |
14 |
| Ebara Corporation | 2094 |
9 |
| Fujimi Incorporated | 708 |
5 |
| Tianjin University | 764 |
3 |
| Toyo Tire & Rubber Co., Ltd. | 567 |
3 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 41068 |
2 |
| Hoya Corporation | 2741 |
2 |
| Tsinghua University | 5748 |
2 |
| Entegris, Inc. | 1830 |
2 |
| Fujibo Holdings, Inc. | 100 |
2 |
| Hwatsing Technology Co., Ltd. | 27 |
2 |
| Sunnen Products Company | 41 |
2 |
| Samsung Electronics Co., Ltd. | 140622 |
1 |
| 3m Innovative Properties Company | 18000 |
1 |
| Panasonic Corporation | 20286 |
1 |
| Mitsubishi Electric Corporation | 45128 |
1 |
| Huawei Technologies Co., Ltd. | 108034 |
1 |
| Seagate Technology LLC | 3975 |
1 |
| Corning Incorporated | 10155 |
1 |
| Siemens Energy, Inc. | 1733 |
1 |
| Other owners | 23 |