- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 9/06 - Machines or devices designed for grinding edges or bevels on work or for removing burrsAccessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
Patent holdings for IPC class B24B 9/06
Total number of patents in this class: 204
10-year publication summary
|
20
|
15
|
17
|
17
|
12
|
12
|
9
|
12
|
10
|
14
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 2345 |
48 |
| Disco Corporation | 1957 |
11 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48629 |
8 |
| Corning Incorporated | 10518 |
7 |
| Sumco Corporation | 1106 |
6 |
| Shin-Etsu Handotai Co., Ltd. | 1307 |
5 |
| Ancora S.p.A. | 26 |
5 |
| Sumitomo Electric Industries, Ltd. | 16331 |
4 |
| Shin-Etsu Chemical Co., Ltd. | 6127 |
4 |
| Globalwafers Co., Ltd. | 731 |
4 |
| Tokyo Seimitsu Co., Ltd. | 417 |
4 |
| Elettromeccanica Bovone S.r.l. | 7 |
3 |
| SK Siltron Co., Ltd. | 176 |
3 |
| Soltek S.r.l. | 6 |
3 |
| Keda Industrial Group Co., Ltd. | 61 |
3 |
| Samsung Electronics Co., Ltd. | 158605 |
2 |
| 3m Innovative Properties Company | 17459 |
2 |
| Tokyo Electron Limited | 13884 |
2 |
| Seagate Technology LLC | 3962 |
2 |
| Essilor International (compagnie Generale D'optique) | 2995 |
2 |
| Other owners | 76 |