- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 9/06 - Machines or devices designed for grinding edges or bevels on work or for removing burrsAccessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
Patent holdings for IPC class B24B 9/06
Total number of patents in this class: 199
10-year publication summary
|
20
|
15
|
17
|
17
|
12
|
12
|
9
|
12
|
10
|
9
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 2320 |
47 |
| Disco Corporation | 1955 |
11 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48214 |
8 |
| Corning Incorporated | 10499 |
7 |
| Sumco Corporation | 1109 |
6 |
| Shin-Etsu Handotai Co., Ltd. | 1307 |
5 |
| Ancora S.p.A. | 26 |
5 |
| Sumitomo Electric Industries, Ltd. | 16303 |
4 |
| Shin-Etsu Chemical Co., Ltd. | 6063 |
4 |
| Globalwafers Co., Ltd. | 730 |
4 |
| Elettromeccanica Bovone S.r.l. | 7 |
3 |
| SK Siltron Co., Ltd. | 171 |
3 |
| Soltek S.r.l. | 6 |
3 |
| Keda Industrial Group Co., Ltd. | 58 |
3 |
| Samsung Electronics Co., Ltd. | 157300 |
2 |
| 3m Innovative Properties Company | 17497 |
2 |
| Tokyo Electron Limited | 13770 |
2 |
| Seagate Technology LLC | 3963 |
2 |
| Essilor International (compagnie Generale D'optique) | 2999 |
2 |
| Lapmaster International, LLC | 22 |
2 |
| Other owners | 74 |