- All sections
- C - Chemistrymetallurgy
- C23F - Non-mechanical removal of metallic material from surfacesinhibiting corrosion of metallic materialinhibiting incrustation in generalmulti-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
- C23F 4/00 - Processes for removing metallic material from surfaces, not provided for in group or
Patent holdings for IPC class C23F 4/00
Total number of patents in this class: 341
10-year publication summary
44
|
30
|
38
|
40
|
25
|
20
|
17
|
12
|
5
|
8
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Tokyo Electron Limited | 12540 |
38 |
Lam Research Corporation | 5187 |
19 |
Applied Materials, Inc. | 18406 |
18 |
Hitachi High-Tech Corporation | 5241 |
10 |
Hon Hai Precision Industry Co., Ltd. | 4039 |
8 |
Tsinghua University | 5840 |
8 |
Canon Anelva Corporation | 686 |
8 |
Adeia Semiconductor Solutions LLC | 290 |
8 |
Varian Semiconductor Equipment Associates, Inc. | 1233 |
6 |
Techinsights Inc. | 95 |
6 |
Samsung Display Co., Ltd. | 34230 |
5 |
FUJIFILM Corporation | 29228 |
5 |
Japan Aviation Electronics Industry, Limited | 1696 |
5 |
Toyo Kohan Co., Ltd. | 415 |
5 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 42118 |
4 |
Seagate Technology LLC | 3967 |
4 |
Boe Technology Group Co., Ltd. | 40613 |
4 |
Central Glass Company, Limited | 1264 |
4 |
Tohoku University | 2755 |
4 |
Samsung Electronics Co., Ltd. | 144143 |
3 |
Other owners | 169 |