- All sections
- C - Chemistrymetallurgy
- C23F - Non-mechanical removal of metallic material from surfacesinhibiting corrosion of metallic materialinhibiting incrustation in generalmulti-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
- C23F 4/00 - Processes for removing metallic material from surfaces, not provided for in group or
Patent holdings for IPC class C23F 4/00
Total number of patents in this class: 343
10-year publication summary
43
|
29
|
38
|
40
|
24
|
20
|
17
|
12
|
5
|
11
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Tokyo Electron Limited | 12795 |
38 |
Lam Research Corporation | 5282 |
19 |
Applied Materials, Inc. | 18759 |
18 |
Hitachi High-Tech Corporation | 5343 |
10 |
Hon Hai Precision Industry Co., Ltd. | 4029 |
8 |
Tsinghua University | 5938 |
8 |
Canon Anelva Corporation | 685 |
8 |
Adeia Semiconductor Solutions LLC | 291 |
8 |
Varian Semiconductor Equipment Associates, Inc. | 1231 |
6 |
Techinsights Inc. | 93 |
6 |
Samsung Display Co., Ltd. | 34984 |
5 |
FUJIFILM Corporation | 29458 |
5 |
Japan Aviation Electronics Industry, Limited | 1721 |
5 |
Toyo Kohan Co., Ltd. | 419 |
5 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 43015 |
4 |
Seagate Technology LLC | 3970 |
4 |
Boe Technology Group Co., Ltd. | 41346 |
4 |
Central Glass Company, Limited | 1264 |
4 |
Tohoku University | 2790 |
4 |
Samsung Electronics Co., Ltd. | 147003 |
3 |
Other owners | 171 |