- All sections
- C - Chemistrymetallurgy
- C23F - Non-mechanical removal of metallic material from surfacesinhibiting corrosion of metallic materialinhibiting incrustation in generalmulti-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
- C23F 4/00 - Processes for removing metallic material from surfaces, not provided for in group or
Patent holdings for IPC class C23F 4/00
Total number of patents in this class: 345
10-year publication summary
|
29
|
38
|
40
|
24
|
20
|
17
|
13
|
5
|
13
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Tokyo Electron Limited | 13185 |
38 |
| Lam Research Corporation | 5387 |
20 |
| Applied Materials, Inc. | 19361 |
19 |
| Hitachi High-Tech Corporation | 5496 |
10 |
| Hon Hai Precision Industry Co., Ltd. | 4014 |
8 |
| Tsinghua University | 6042 |
8 |
| Canon Anelva Corporation | 690 |
8 |
| Adeia Semiconductor Solutions LLC | 292 |
8 |
| Varian Semiconductor Equipment Associates, Inc. | 1222 |
6 |
| Techinsights Inc. | 95 |
6 |
| Samsung Display Co., Ltd. | 36582 |
5 |
| FUJIFILM Corporation | 29871 |
5 |
| Central Glass Company, Limited | 1271 |
5 |
| Japan Aviation Electronics Industry, Limited | 1785 |
5 |
| Toyo Kohan Co., Ltd. | 422 |
5 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46267 |
4 |
| Seagate Technology LLC | 3979 |
4 |
| Boe Technology Group Co., Ltd. | 41901 |
4 |
| Tohoku University | 2852 |
4 |
| Samsung Electronics Co., Ltd. | 149582 |
3 |
| Other owners | 170 |