- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/3115 - Doping the insulating layers
Patent holdings for IPC class H01L 21/3115
Total number of patents in this class: 793
10-year publication summary
|
88
|
89
|
98
|
90
|
60
|
72
|
57
|
63
|
64
|
15
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47602 |
335 |
| Applied Materials, Inc. | 20112 |
59 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1739 |
33 |
| International Business Machines Corporation | 62295 |
32 |
| Samsung Electronics Co., Ltd. | 154751 |
26 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1032 |
25 |
| Adeia Semiconductor Solutions LLC | 759 |
21 |
| Commissariat à l'énergie atomique et aux energies alternatives | 11020 |
18 |
| United Microelectronics Corp. | 4456 |
16 |
| Micron Technology, Inc. | 27348 |
15 |
| Varian Semiconductor Equipment Associates, Inc. | 1194 |
13 |
| Infineon Technologies AG | 8382 |
11 |
| GLOBALFOUNDRIES U.S. Inc. | 6397 |
9 |
| Nanya Technology Corporation | 2867 |
9 |
| Marlin Semiconductor Limited | 393 |
9 |
| Intel Corporation | 46718 |
8 |
| Semiconductor Energy Laboratory Co., Ltd. | 11708 |
8 |
| SK Hynix Inc. | 12212 |
6 |
| Winbond Electronics Corp. | 1396 |
6 |
| Sony Corporation | 30353 |
5 |
| Other owners | 129 |