- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/3115 - Doping the insulating layers
Patent holdings for IPC class H01L 21/3115
Total number of patents in this class: 722
10-year publication summary
68
|
88
|
89
|
98
|
90
|
60
|
72
|
56
|
61
|
10
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 41489 |
303 |
Applied Materials, Inc. | 18282 |
47 |
International Business Machines Corporation | 60549 |
32 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1773 |
29 |
Semiconductor Manufacturing International (Beijing) Corporation | 1032 |
25 |
Samsung Electronics Co., Ltd. | 141952 |
22 |
Commissariat à l'énergie atomique et aux energies alternatives | 10734 |
18 |
Micron Technology, Inc. | 26067 |
14 |
United Microelectronics Corp. | 4174 |
14 |
Varian Semiconductor Equipment Associates, Inc. | 1238 |
13 |
Tessera, Inc. | 628 |
13 |
Infineon Technologies AG | 8177 |
11 |
Intel Corporation | 46581 |
9 |
GLOBALFOUNDRIES U.S. Inc. | 6439 |
9 |
Semiconductor Energy Laboratory Co., Ltd. | 11231 |
8 |
Marlin Semiconductor Limited | 448 |
8 |
Adeia Semiconductor Solutions LLC | 279 |
7 |
SK Hynix Inc. | 11054 |
6 |
Nanya Technology Corporation | 2312 |
6 |
Winbond Electronics Corp. | 1262 |
6 |
Other owners | 122 |