- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/3205 - Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layersAfter-treatment of these layers
Patent holdings for IPC class H01L 21/3205
Total number of patents in this class: 3601
10-year publication summary
|
298
|
271
|
255
|
242
|
190
|
153
|
156
|
155
|
137
|
72
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48539 |
311 |
| Sony Semiconductor Solutions Corporation | 11680 |
259 |
| Tokyo Electron Limited | 13854 |
217 |
| Applied Materials, Inc. | 20459 |
137 |
| Panasonic Corporation | 18896 |
110 |
| Samsung Electronics Co., Ltd. | 158337 |
90 |
| GLOBALFOUNDRIES U.S. Inc. | 6384 |
86 |
| International Business Machines Corporation | 62742 |
76 |
| Texas Instruments Incorporated | 19636 |
76 |
| Micron Technology, Inc. | 27709 |
66 |
| Rohm Co., Ltd. | 6846 |
58 |
| Sony Corporation | 30128 |
55 |
| Sharp Kabushiki Kaisha | 18520 |
55 |
| Intel Corporation | 47069 |
54 |
| Renesas Electronics Corporation | 5862 |
53 |
| Mitsubishi Electric Corporation | 48146 |
53 |
| United Microelectronics Corp. | 4500 |
48 |
| Kokusai Electric Corporation | 2237 |
47 |
| Semiconductor Energy Laboratory Co., Ltd. | 11854 |
41 |
| ULVAC, Inc. | 1344 |
38 |
| Other owners | 1671 |