- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/423 - Bombardment with radiation with high-energy radiation
Patent holdings for IPC class H01L 21/423
Total number of patents in this class: 18
10-year publication summary
|
1
|
3
|
4
|
2
|
1
|
2
|
1
|
0
|
2
|
1
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| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Boe Technology Group Co., Ltd. | 41615 |
3 |
| Chengdu CEC Panda Display Technology Co., Ltd. | 11 |
2 |
| FUJIFILM Corporation | 29775 |
1 |
| Semiconductor Energy Laboratory Co., Ltd. | 11534 |
1 |
| Applied Materials, Inc. | 19173 |
1 |
| Varian Semiconductor Equipment Associates, Inc. | 1227 |
1 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 45590 |
1 |
| Shenzhen China Star Optoelectronics Technology Co., Ltd. | 8475 |
1 |
| GLOBALFOUNDRIES U.S. Inc. | 6417 |
1 |
| The Government of the United States of America, as represented by the Secretary of the Navy | 1359 |
1 |
| Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences | 304 |
1 |
| Tessera, Inc. | 614 |
1 |
| Tel Manufacturing and Engineering of America, Inc. | 139 |
1 |
| Nielson Scientific, LLC | 15 |
1 |
| Adeia Semiconductor Solutions LLC | 292 |
1 |
| Other owners | 0 |