- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/425 - Bombardment with radiation with high-energy radiation producing ion implantation
Patent holdings for IPC class H01L 21/425
Total number of patents in this class: 476
10-year publication summary
|
36
|
10
|
10
|
9
|
11
|
17
|
7
|
10
|
11
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47319 |
36 |
| Semiconductor Energy Laboratory Co., Ltd. | 11680 |
31 |
| Varian Semiconductor Equipment Associates, Inc. | 1197 |
24 |
| Texas Instruments Incorporated | 19631 |
21 |
| Infineon Technologies AG | 8377 |
12 |
| International Business Machines Corporation | 62220 |
11 |
| Fuji Electric Co., Ltd. | 5390 |
11 |
| Samsung Electronics Co., Ltd. | 153845 |
10 |
| Micron Technology, Inc. | 27285 |
10 |
| Denso Corporation | 25183 |
10 |
| Applied Materials, Inc. | 20036 |
9 |
| Boe Technology Group Co., Ltd. | 42957 |
9 |
| Toyota Motor Corporation | 34633 |
8 |
| Tamura Corporation | 359 |
8 |
| MIRISE Technologies Corporation | 369 |
7 |
| Infineon Technologies Austria AG | 2294 |
6 |
| Shin-Etsu Chemical Co., Ltd. | 5948 |
6 |
| Advanced ION Beam Technology, Inc. | 69 |
6 |
| GLOBALFOUNDRIES U.S. Inc. | 6396 |
6 |
| MIE Fujitsu Semiconductor Limited | 115 |
6 |
| Other owners | 229 |