- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 5955
10-year publication summary
|
687
|
604
|
561
|
585
|
569
|
446
|
398
|
344
|
377
|
5
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46308 |
721 |
| Disco Corporation | 1910 |
510 |
| Semiconductor Components Industries, L.L.C. | 5297 |
235 |
| Infineon Technologies AG | 8290 |
225 |
| Samsung Electronics Co., Ltd. | 149838 |
200 |
| Micron Technology, Inc. | 26703 |
173 |
| Texas Instruments Incorporated | 19521 |
169 |
| Applied Materials, Inc. | 19391 |
158 |
| Intel Corporation | 46510 |
78 |
| Panasonic Intellectual Property Management Co., Ltd. | 32675 |
68 |
| Renesas Electronics Corporation | 5920 |
55 |
| Kioxia Corporation | 10479 |
55 |
| STATS ChipPAC Pte. Lte. | 1554 |
52 |
| Hamamatsu Photonics K.K. | 4531 |
48 |
| NXP USA, Inc. | 4365 |
47 |
| Plasma-therm, LLC | 82 |
45 |
| Advanced Semiconductor Engineering, Inc. | 1683 |
44 |
| Infineon Technologies Austria AG | 2224 |
42 |
| Mitsubishi Electric Corporation | 47131 |
40 |
| Xintec Inc. | 276 |
40 |
| Other owners | 2950 |