- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 6035
10-year publication summary
|
687
|
604
|
561
|
585
|
570
|
447
|
401
|
348
|
377
|
78
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46735 |
728 |
| Disco Corporation | 1919 |
516 |
| Semiconductor Components Industries, L.L.C. | 5282 |
238 |
| Infineon Technologies AG | 8332 |
226 |
| Samsung Electronics Co., Ltd. | 152016 |
209 |
| Micron Technology, Inc. | 27215 |
180 |
| Texas Instruments Incorporated | 19574 |
175 |
| Applied Materials, Inc. | 19802 |
160 |
| Intel Corporation | 46594 |
77 |
| Panasonic Intellectual Property Management Co., Ltd. | 33120 |
68 |
| Renesas Electronics Corporation | 5887 |
57 |
| Kioxia Corporation | 10555 |
55 |
| NXP USA, Inc. | 4404 |
49 |
| Hamamatsu Photonics K.K. | 4581 |
48 |
| Plasma-therm, LLC | 82 |
45 |
| Advanced Semiconductor Engineering, Inc. | 1690 |
44 |
| Infineon Technologies Austria AG | 2263 |
42 |
| Mitsubishi Electric Corporation | 47416 |
41 |
| Rohm Co., Ltd. | 6695 |
40 |
| Xintec Inc. | 276 |
40 |
| Other owners | 2997 |