- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 6056
10-year publication summary
|
687
|
605
|
561
|
585
|
569
|
442
|
378
|
333
|
379
|
165
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48629 |
739 |
| Disco Corporation | 1957 |
512 |
| Semiconductor Components Industries, L.L.C. | 5255 |
237 |
| Infineon Technologies AG | 8410 |
227 |
| Samsung Electronics Co., Ltd. | 158605 |
211 |
| Texas Instruments Incorporated | 19639 |
177 |
| Micron Technology, Inc. | 27666 |
176 |
| Applied Materials, Inc. | 20514 |
161 |
| Intel Corporation | 47162 |
79 |
| Panasonic Intellectual Property Management Co., Ltd. | 34335 |
70 |
| Kioxia Corporation | 10879 |
59 |
| Renesas Electronics Corporation | 5863 |
58 |
| NXP USA, Inc. | 4406 |
48 |
| Hamamatsu Photonics K.K. | 4695 |
45 |
| Advanced Semiconductor Engineering, Inc. | 1752 |
45 |
| Plasma-therm, LLC | 82 |
45 |
| Infineon Technologies Austria AG | 2351 |
44 |
| Mitsubishi Electric Corporation | 48236 |
43 |
| Rohm Co., Ltd. | 6885 |
40 |
| STATS ChipPAC Pte. Lte. | 974 |
40 |
| Other owners | 3000 |