- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 5860
10-year publication summary
|
621
|
687
|
604
|
561
|
585
|
568
|
443
|
391
|
343
|
303
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44282 |
701 |
| Disco Corporation | 1885 |
501 |
| Semiconductor Components Industries, L.L.C. | 5289 |
232 |
| Infineon Technologies AG | 8266 |
223 |
| Samsung Electronics Co., Ltd. | 148173 |
196 |
| Micron Technology, Inc. | 26317 |
170 |
| Texas Instruments Incorporated | 19459 |
167 |
| Applied Materials, Inc. | 19031 |
158 |
| Intel Corporation | 46937 |
82 |
| Panasonic Intellectual Property Management Co., Ltd. | 32139 |
67 |
| Renesas Electronics Corporation | 5965 |
57 |
| Kioxia Corporation | 10440 |
55 |
| STATS ChipPAC Pte. Lte. | 1548 |
52 |
| NXP USA, Inc. | 4324 |
47 |
| Hamamatsu Photonics K.K. | 4461 |
46 |
| Plasma-therm, LLC | 82 |
45 |
| Advanced Semiconductor Engineering, Inc. | 1671 |
44 |
| Infineon Technologies Austria AG | 2197 |
41 |
| Mitsubishi Electric Corporation | 46672 |
40 |
| Xintec Inc. | 274 |
40 |
| Other owners | 2896 |