- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 5774
10-year publication summary
622
|
687
|
605
|
561
|
586
|
568
|
444
|
384
|
343
|
226
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 42863 |
686 |
Disco Corporation | 1864 |
500 |
Semiconductor Components Industries, L.L.C. | 5254 |
228 |
Infineon Technologies AG | 8221 |
223 |
Samsung Electronics Co., Ltd. | 146534 |
194 |
Micron Technology, Inc. | 26256 |
168 |
Texas Instruments Incorporated | 19448 |
164 |
Applied Materials, Inc. | 18706 |
158 |
Intel Corporation | 47013 |
82 |
Panasonic Intellectual Property Management Co., Ltd. | 31515 |
67 |
Renesas Electronics Corporation | 6006 |
56 |
Kioxia Corporation | 10301 |
56 |
STATS ChipPAC Pte. Lte. | 1553 |
52 |
NXP USA, Inc. | 4297 |
47 |
Hamamatsu Photonics K.K. | 4419 |
45 |
Plasma-therm, LLC | 83 |
45 |
Advanced Semiconductor Engineering, Inc. | 1656 |
44 |
Infineon Technologies Austria AG | 2152 |
40 |
Mitsubishi Electric Corporation | 46160 |
40 |
Rohm Co., Ltd. | 6462 |
39 |
Other owners | 2840 |