- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 5929
10-year publication summary
|
621
|
687
|
604
|
561
|
585
|
568
|
446
|
394
|
343
|
362
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46182 |
720 |
| Disco Corporation | 1900 |
505 |
| Semiconductor Components Industries, L.L.C. | 5297 |
235 |
| Infineon Technologies AG | 8293 |
225 |
| Samsung Electronics Co., Ltd. | 149198 |
198 |
| Micron Technology, Inc. | 26591 |
172 |
| Texas Instruments Incorporated | 19498 |
169 |
| Applied Materials, Inc. | 19298 |
158 |
| Intel Corporation | 46471 |
78 |
| Panasonic Intellectual Property Management Co., Ltd. | 32504 |
67 |
| Renesas Electronics Corporation | 5925 |
55 |
| Kioxia Corporation | 10455 |
55 |
| STATS ChipPAC Pte. Lte. | 1546 |
52 |
| Hamamatsu Photonics K.K. | 4499 |
48 |
| NXP USA, Inc. | 4353 |
47 |
| Plasma-therm, LLC | 82 |
45 |
| Advanced Semiconductor Engineering, Inc. | 1678 |
44 |
| Infineon Technologies Austria AG | 2221 |
42 |
| Mitsubishi Electric Corporation | 46973 |
40 |
| Xintec Inc. | 276 |
40 |
| Other owners | 2934 |