• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/786 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element the substrate being other than a semiconductor body, e.g. insulating body

Patent holdings for IPC class H01L 21/786

Total number of patents in this class: 87

10-year publication summary

8
8
10
8
9
7
4
7
5
0
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
42863
10
Semiconductor Components Industries, L.L.C.
5254
6
Shenzhen China Star Optoelectronics Technology Co., Ltd.
8478
5
Boe Technology Group Co., Ltd.
41267
5
Applied Materials, Inc.
18706
4
Disco Corporation
1864
4
STATS ChipPAC Pte. Lte.
1553
4
Advanced Semiconductor Engineering, Inc.
1656
3
Rohm Co., Ltd.
6462
2
Commissariat à l'énergie atomique et aux energies alternatives
10917
2
Nichia Corporation
3708
2
Mikro Mesa Technology Co., Ltd.
106
2
NXP USA, Inc.
4297
2
Samsung Electronics Co., Ltd.
146534
1
Samsung Display Co., Ltd.
34842
1
LG Electronics Inc.
73210
1
International Business Machines Corporation
61287
1
Centre National de La Recherche Scientifique
10442
1
Intel Corporation
47013
1
Hon Hai Precision Industry Co., Ltd.
4027
1
Other owners 29