• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/786 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element the substrate being other than a semiconductor body, e.g. insulating body

Patent holdings for IPC class H01L 21/786

Total number of patents in this class: 85

10-year publication summary

8
10
8
9
7
4
5
5
1
0
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
48861
10
Semiconductor Components Industries, L.L.C.
5265
6
Shenzhen China Star Optoelectronics Technology Co., Ltd.
8470
5
Boe Technology Group Co., Ltd.
44653
5
Applied Materials, Inc.
20579
4
Disco Corporation
1960
4
Advanced Semiconductor Engineering, Inc.
1761
3
Rohm Co., Ltd.
6908
2
Nichia Corporation
3889
2
Mikro Mesa Technology Co., Ltd.
107
2
STATS ChipPAC Pte. Lte.
972
2
NXP USA, Inc.
4410
2
Adeia Semiconductor Bonding Technologies Inc.
615
2
Samsung Electronics Co., Ltd.
159029
1
Samsung Display Co., Ltd.
39087
1
LG Electronics Inc.
76087
1
International Business Machines Corporation
62805
1
Centre National de La Recherche Scientifique
11111
1
Intel Corporation
46292
1
Hon Hai Precision Industry Co., Ltd.
4019
1
Other owners 29