- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/786 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element the substrate being other than a semiconductor body, e.g. insulating body
Patent holdings for IPC class H01L 21/786
Total number of patents in this class: 85
10-year publication summary
|
8
|
10
|
8
|
9
|
7
|
4
|
5
|
5
|
1
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48861 |
10 |
| Semiconductor Components Industries, L.L.C. | 5265 |
6 |
| Shenzhen China Star Optoelectronics Technology Co., Ltd. | 8470 |
5 |
| Boe Technology Group Co., Ltd. | 44653 |
5 |
| Applied Materials, Inc. | 20579 |
4 |
| Disco Corporation | 1960 |
4 |
| Advanced Semiconductor Engineering, Inc. | 1761 |
3 |
| Rohm Co., Ltd. | 6908 |
2 |
| Nichia Corporation | 3889 |
2 |
| Mikro Mesa Technology Co., Ltd. | 107 |
2 |
| STATS ChipPAC Pte. Lte. | 972 |
2 |
| NXP USA, Inc. | 4410 |
2 |
| Adeia Semiconductor Bonding Technologies Inc. | 615 |
2 |
| Samsung Electronics Co., Ltd. | 159029 |
1 |
| Samsung Display Co., Ltd. | 39087 |
1 |
| LG Electronics Inc. | 76087 |
1 |
| International Business Machines Corporation | 62805 |
1 |
| Centre National de La Recherche Scientifique | 11111 |
1 |
| Intel Corporation | 46292 |
1 |
| Hon Hai Precision Industry Co., Ltd. | 4019 |
1 |
| Other owners | 29 |