- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/82 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
Patent holdings for IPC class H01L 21/82
Total number of patents in this class: 1867
10-year publication summary
141
|
158
|
168
|
128
|
163
|
103
|
81
|
87
|
84
|
29
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 42804 |
220 |
Socionext Inc. | 1549 |
115 |
NEC Corporation | 35687 |
71 |
Panasonic Corporation | 20099 |
70 |
Samsung Electronics Co., Ltd. | 146346 |
66 |
International Business Machines Corporation | 61257 |
63 |
Micron Technology, Inc. | 26238 |
57 |
Texas Instruments Incorporated | 19460 |
40 |
Renesas Electronics Corporation | 6009 |
39 |
Semiconductor Energy Laboratory Co., Ltd. | 11416 |
38 |
GLOBALFOUNDRIES U.S. Inc. | 6432 |
29 |
Rohm Co., Ltd. | 6459 |
27 |
Applied Materials, Inc. | 18658 |
25 |
Boe Technology Group Co., Ltd. | 41217 |
24 |
Fujitsu Limited | 18366 |
22 |
Infineon Technologies AG | 8225 |
22 |
Intel Corporation | 47005 |
20 |
Disco Corporation | 1860 |
17 |
Panasonic Intellectual Property Management Co., Ltd. | 31475 |
16 |
United Microelectronics Corp. | 4229 |
15 |
Other owners | 871 |