• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/82 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components

Patent holdings for IPC class H01L 21/82

Total number of patents in this class: 1830

10-year publication summary

158
168
127
163
103
80
81
82
32
0
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
46308
218
Socionext Inc.
1572
117
NEC Corporation
36334
71
Panasonic Corporation
19924
70
Samsung Electronics Co., Ltd.
149838
65
International Business Machines Corporation
61840
63
Micron Technology, Inc.
26703
56
Renesas Electronics Corporation
5920
38
Semiconductor Energy Laboratory Co., Ltd.
11549
38
Texas Instruments Incorporated
19521
37
GLOBALFOUNDRIES U.S. Inc.
6417
29
Rohm Co., Ltd.
6590
26
Applied Materials, Inc.
19391
25
Boe Technology Group Co., Ltd.
42050
24
Infineon Technologies AG
8290
21
Intel Corporation
46510
18
Fujitsu Limited
17637
18
Disco Corporation
1910
17
Panasonic Intellectual Property Management Co., Ltd.
32675
16
United Microelectronics Corp.
4330
15
Other owners 848