• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/82 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components

Patent holdings for IPC class H01L 21/82

Total number of patents in this class: 1837

10-year publication summary

140
158
168
127
163
103
81
82
83
32
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
46161
219
Socionext Inc.
1574
117
NEC Corporation
36257
71
Panasonic Corporation
19966
70
Samsung Electronics Co., Ltd.
149087
65
International Business Machines Corporation
61721
63
Micron Technology, Inc.
26558
57
Renesas Electronics Corporation
5928
38
Semiconductor Energy Laboratory Co., Ltd.
11552
38
Texas Instruments Incorporated
19495
37
GLOBALFOUNDRIES U.S. Inc.
6418
29
Rohm Co., Ltd.
6560
26
Applied Materials, Inc.
19248
25
Boe Technology Group Co., Ltd.
41781
24
Infineon Technologies AG
8287
21
Intel Corporation
46460
20
Fujitsu Limited
17652
19
Disco Corporation
1900
17
Panasonic Intellectual Property Management Co., Ltd.
32457
16
United Microelectronics Corp.
4307
15
Other owners 850