- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/82 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
Patent holdings for IPC class H01L 21/82
Total number of patents in this class: 1837
10-year publication summary
|
140
|
158
|
168
|
127
|
163
|
103
|
81
|
82
|
83
|
32
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46161 |
219 |
| Socionext Inc. | 1574 |
117 |
| NEC Corporation | 36257 |
71 |
| Panasonic Corporation | 19966 |
70 |
| Samsung Electronics Co., Ltd. | 149087 |
65 |
| International Business Machines Corporation | 61721 |
63 |
| Micron Technology, Inc. | 26558 |
57 |
| Renesas Electronics Corporation | 5928 |
38 |
| Semiconductor Energy Laboratory Co., Ltd. | 11552 |
38 |
| Texas Instruments Incorporated | 19495 |
37 |
| GLOBALFOUNDRIES U.S. Inc. | 6418 |
29 |
| Rohm Co., Ltd. | 6560 |
26 |
| Applied Materials, Inc. | 19248 |
25 |
| Boe Technology Group Co., Ltd. | 41781 |
24 |
| Infineon Technologies AG | 8287 |
21 |
| Intel Corporation | 46460 |
20 |
| Fujitsu Limited | 17652 |
19 |
| Disco Corporation | 1900 |
17 |
| Panasonic Intellectual Property Management Co., Ltd. | 32457 |
16 |
| United Microelectronics Corp. | 4307 |
15 |
| Other owners | 850 |