- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/02 - ContainersSeals
Patent holdings for IPC class H01L 23/02
Total number of patents in this class: 2708
10-year publication summary
|
155
|
157
|
122
|
138
|
113
|
89
|
92
|
63
|
53
|
24
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 157946 |
156 |
| Kyocera Corporation | 14383 |
147 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48438 |
136 |
| Murata Manufacturing Co., Ltd. | 25758 |
121 |
| STATS ChipPAC Management Pte. Ltd. | 545 |
81 |
| STATS ChipPAC Pte. Lte. | 971 |
74 |
| Sony Semiconductor Solutions Corporation | 11613 |
73 |
| Micron Technology, Inc. | 27675 |
71 |
| Mitsubishi Electric Corporation | 48048 |
71 |
| Nippon Electric Glass Co., Ltd. | 2558 |
55 |
| Intel Corporation | 47122 |
52 |
| Infineon Technologies AG | 8402 |
48 |
| Advanced Semiconductor Engineering, Inc. | 1747 |
44 |
| Texas Instruments Incorporated | 19653 |
30 |
| Renesas Electronics Corporation | 5864 |
27 |
| Semiconductor Components Industries, L.L.C. | 5263 |
27 |
| International Business Machines Corporation | 62671 |
26 |
| Amkor Technology Singapore Holding Pte.ltd. | 484 |
23 |
| Adeia Semiconductor Solutions LLC | 760 |
23 |
| Daishinku Corporation | 258 |
22 |
| Other owners | 1401 |