- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
Patent holdings for IPC class H01L 23/14
Total number of patents in this class: 2280
10-year publication summary
|
144
|
190
|
183
|
190
|
184
|
175
|
153
|
181
|
195
|
105
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48629 |
253 |
| Intel Corporation | 47162 |
112 |
| Samsung Electronics Co., Ltd. | 158605 |
82 |
| Murata Manufacturing Co., Ltd. | 25847 |
50 |
| Resonac Corporation | 3624 |
42 |
| Kyocera Corporation | 14433 |
38 |
| Semiconductor Components Industries, L.L.C. | 5255 |
35 |
| Applied Materials, Inc. | 20514 |
34 |
| Infineon Technologies AG | 8410 |
33 |
| Rohm Co., Ltd. | 6885 |
33 |
| Mitsubishi Electric Corporation | 48236 |
32 |
| Adeia Semiconductor Technologies LLC | 594 |
31 |
| Mitsubishi Materials Corporation | 2481 |
30 |
| Texas Instruments Incorporated | 19639 |
28 |
| Shinko Electric Industries Co., Ltd. | 1241 |
28 |
| Fuji Electric Co., Ltd. | 5521 |
27 |
| Qualcomm Incorporated | 93006 |
26 |
| Micron Technology, Inc. | 27666 |
25 |
| Advanced Semiconductor Engineering, Inc. | 1752 |
24 |
| Siliconware Precision Industries Co., Ltd. | 698 |
24 |
| Other owners | 1293 |