- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
Patent holdings for IPC class H01L 23/485
Total number of patents in this class: 1944
10-year publication summary
|
163
|
235
|
211
|
146
|
135
|
121
|
111
|
80
|
65
|
17
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
410 |
| Samsung Electronics Co., Ltd. | 157557 |
152 |
| International Business Machines Corporation | 62621 |
107 |
| Intel Corporation | 47102 |
96 |
| Qualcomm Incorporated | 91997 |
40 |
| United Microelectronics Corp. | 4492 |
37 |
| Texas Instruments Incorporated | 19663 |
34 |
| GLOBALFOUNDRIES U.S. Inc. | 6391 |
34 |
| Renesas Electronics Corporation | 5879 |
31 |
| Micron Technology, Inc. | 27626 |
28 |
| Monolithic 3D Inc. | 332 |
21 |
| NXP B.V. | 1420 |
20 |
| Commissariat à l'énergie atomique et aux energies alternatives | 11127 |
17 |
| Huawei Technologies Co., Ltd. | 123282 |
16 |
| IBM United Kingdom Limited | 4079 |
16 |
| Parabellum Strategic Opportunities Fund LLC | 207 |
16 |
| Infineon Technologies AG | 8400 |
15 |
| Samsung Display Co., Ltd. | 38570 |
14 |
| Advanced Semiconductor Engineering, Inc. | 1740 |
14 |
| Applied Materials, Inc. | 20363 |
13 |
| Other owners | 813 |