- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
Patent holdings for IPC class H01L 23/485
Total number of patents in this class: 1930
10-year publication summary
|
163
|
235
|
211
|
146
|
135
|
121
|
109
|
78
|
63
|
17
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49440 |
410 |
| Samsung Electronics Co., Ltd. | 159755 |
152 |
| International Business Machines Corporation | 62871 |
106 |
| Intel Corporation | 46342 |
96 |
| Qualcomm Incorporated | 93957 |
40 |
| United Microelectronics Corp. | 4537 |
37 |
| GLOBALFOUNDRIES U.S. Inc. | 6396 |
34 |
| Texas Instruments Incorporated | 19643 |
33 |
| Renesas Electronics Corporation | 5844 |
31 |
| Micron Technology, Inc. | 27932 |
28 |
| Monolithic 3D Inc. | 344 |
21 |
| NXP B.V. | 1341 |
18 |
| Commissariat à l'énergie atomique et aux energies alternatives | 11137 |
17 |
| Huawei Technologies Co., Ltd. | 125590 |
16 |
| IBM United Kingdom Limited | 4036 |
16 |
| Parabellum Strategic Opportunities Fund LLC | 206 |
16 |
| Infineon Technologies AG | 8432 |
15 |
| Samsung Display Co., Ltd. | 39307 |
14 |
| Advanced Semiconductor Engineering, Inc. | 1763 |
14 |
| Applied Materials, Inc. | 20654 |
13 |
| Other owners | 803 |