- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/525 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
Patent holdings for IPC class H01L 23/525
Total number of patents in this class: 1754
10-year publication summary
|
219
|
194
|
181
|
157
|
140
|
129
|
133
|
100
|
85
|
22
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48760 |
330 |
| International Business Machines Corporation | 62769 |
135 |
| Nanya Technology Corporation | 2942 |
82 |
| Samsung Electronics Co., Ltd. | 158842 |
67 |
| Intel Corporation | 46449 |
57 |
| GLOBALFOUNDRIES U.S. Inc. | 6389 |
53 |
| Monolithic 3D Inc. | 341 |
53 |
| Micron Technology, Inc. | 27726 |
50 |
| Changxin Memory Technologies, Inc. | 4933 |
48 |
| SK Hynix Inc. | 12640 |
44 |
| Qualcomm Incorporated | 93172 |
34 |
| United Microelectronics Corp. | 4516 |
33 |
| Texas Instruments Incorporated | 19639 |
31 |
| Renesas Electronics Corporation | 5860 |
30 |
| eMemory Technology Inc. | 411 |
27 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 881 |
19 |
| Infineon Technologies AG | 8418 |
18 |
| Rohm Co., Ltd. | 6898 |
18 |
| Xintec Inc. | 278 |
17 |
| Synopsys, Inc. | 2636 |
15 |
| Other owners | 593 |