- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/525 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
Patent holdings for IPC class H01L 23/525
Total number of patents in this class: 1688
10-year publication summary
|
166
|
219
|
194
|
181
|
157
|
140
|
127
|
127
|
107
|
6
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40644 |
304 |
| International Business Machines Corporation | 60178 |
122 |
| Nanya Technology Corporation | 2231 |
72 |
| Intel Corporation | 46153 |
61 |
| Samsung Electronics Co., Ltd. | 139302 |
60 |
| GLOBALFOUNDRIES U.S. Inc. | 6435 |
53 |
| Monolithic 3D Inc. | 300 |
49 |
| Micron Technology, Inc. | 25845 |
47 |
| Changxin Memory Technologies, Inc. | 4926 |
46 |
| SK Hynix Inc. | 10824 |
44 |
| Renesas Electronics Corporation | 6146 |
36 |
| Qualcomm Incorporated | 82009 |
33 |
| Texas Instruments Incorporated | 19447 |
29 |
| United Microelectronics Corp. | 4117 |
27 |
| eMemory Technology Inc. | 375 |
27 |
| Infineon Technologies AG | 8135 |
18 |
| Rohm Co., Ltd. | 6360 |
18 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 768 |
18 |
| Xintec Inc. | 267 |
17 |
| Synopsys, Inc. | 2804 |
15 |
| Other owners | 592 |