- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
Patent holdings for IPC class H01L 23/532
Total number of patents in this class: 8519
10-year publication summary
|
862
|
918
|
937
|
918
|
902
|
771
|
761
|
779
|
710
|
470
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43258 |
2001 |
| International Business Machines Corporation | 61433 |
614 |
| Samsung Electronics Co., Ltd. | 147501 |
599 |
| Intel Corporation | 47143 |
412 |
| Micron Technology, Inc. | 26183 |
283 |
| Nanya Technology Corporation | 2528 |
254 |
| GLOBALFOUNDRIES U.S. Inc. | 6420 |
219 |
| Applied Materials, Inc. | 18861 |
191 |
| Kioxia Corporation | 10387 |
177 |
| United Microelectronics Corp. | 4244 |
138 |
| Tokyo Electron Limited | 12877 |
121 |
| Texas Instruments Incorporated | 19455 |
113 |
| Renesas Electronics Corporation | 5987 |
113 |
| SK Hynix Inc. | 11469 |
103 |
| Infineon Technologies AG | 8250 |
97 |
| Sandisk Technologies Inc. | 4828 |
85 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1761 |
84 |
| Adeia Semiconductor Solutions LLC | 291 |
78 |
| Rohm Co., Ltd. | 6480 |
75 |
| Changxin Memory Technologies, Inc. | 4927 |
73 |
| Other owners | 2689 |