- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/01 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
Patent holdings for IPC class H01L 27/01
Total number of patents in this class: 665
10-year publication summary
|
42
|
45
|
51
|
45
|
51
|
42
|
46
|
50
|
50
|
8
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42222 |
76 |
| GLOBALFOUNDRIES U.S. Inc. | 6427 |
40 |
| Qualcomm Incorporated | 84634 |
34 |
| Texas Instruments Incorporated | 19482 |
27 |
| International Business Machines Corporation | 61123 |
24 |
| Rohm Co., Ltd. | 6410 |
24 |
| Murata Manufacturing Co., Ltd. | 24369 |
22 |
| Samsung Electronics Co., Ltd. | 144426 |
19 |
| Boe Technology Group Co., Ltd. | 40653 |
18 |
| Intel Corporation | 46751 |
16 |
| Micron Technology, Inc. | 26214 |
14 |
| Samsung Display Co., Ltd. | 34290 |
13 |
| Renesas Electronics Corporation | 6054 |
11 |
| Unisantis Electronics Singapore Pte. Ltd. | 657 |
9 |
| Apple Inc. | 54527 |
8 |
| Semiconductor Energy Laboratory Co., Ltd. | 11371 |
7 |
| Infineon Technologies AG | 8201 |
7 |
| TDK Corporation | 6676 |
7 |
| United Microelectronics Corp. | 4232 |
7 |
| Semiconductor Components Industries, L.L.C. | 5253 |
7 |
| Other owners | 275 |