- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/01 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
Patent holdings for IPC class H01L 27/01
Total number of patents in this class: 671
10-year publication summary
42
|
45
|
51
|
45
|
51
|
42
|
44
|
49
|
52
|
0
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 40583 |
76 |
GLOBALFOUNDRIES U.S. Inc. | 6433 |
41 |
Qualcomm Incorporated | 81758 |
31 |
Texas Instruments Incorporated | 19418 |
29 |
International Business Machines Corporation | 60095 |
25 |
Rohm Co., Ltd. | 6336 |
24 |
Murata Manufacturing Co., Ltd. | 23680 |
22 |
Samsung Electronics Co., Ltd. | 138729 |
21 |
Boe Technology Group Co., Ltd. | 38828 |
18 |
Intel Corporation | 46119 |
15 |
Micron Technology, Inc. | 25791 |
15 |
Samsung Display Co., Ltd. | 32745 |
14 |
Renesas Electronics Corporation | 6153 |
11 |
Unisantis Electronics Singapore Pte. Ltd. | 648 |
9 |
Apple Inc. | 52680 |
7 |
Semiconductor Energy Laboratory Co., Ltd. | 11080 |
7 |
Infineon Technologies AG | 8141 |
7 |
TDK Corporation | 6535 |
7 |
United Microelectronics Corp. | 4102 |
7 |
Semiconductor Components Industries, L.L.C. | 5246 |
7 |
Other owners | 278 |