- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/01 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
Patent holdings for IPC class H01L 27/01
Total number of patents in this class: 641
10-year publication summary
|
42
|
45
|
51
|
45
|
50
|
42
|
45
|
45
|
42
|
10
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 45590 |
72 |
| GLOBALFOUNDRIES U.S. Inc. | 6417 |
38 |
| Qualcomm Incorporated | 87362 |
34 |
| Texas Instruments Incorporated | 19484 |
27 |
| International Business Machines Corporation | 61738 |
23 |
| Rohm Co., Ltd. | 6544 |
22 |
| Murata Manufacturing Co., Ltd. | 24950 |
20 |
| Samsung Electronics Co., Ltd. | 148765 |
19 |
| Boe Technology Group Co., Ltd. | 41615 |
18 |
| Intel Corporation | 46455 |
14 |
| Micron Technology, Inc. | 26461 |
14 |
| Samsung Display Co., Ltd. | 36065 |
13 |
| Renesas Electronics Corporation | 5939 |
10 |
| Unisantis Electronics Singapore Pte. Ltd. | 657 |
9 |
| Apple Inc. | 56170 |
8 |
| Semiconductor Energy Laboratory Co., Ltd. | 11534 |
7 |
| Infineon Technologies AG | 8277 |
7 |
| United Microelectronics Corp. | 4293 |
7 |
| Semiconductor Components Industries, L.L.C. | 5301 |
7 |
| Advanced Semiconductor Engineering, Inc. | 1673 |
7 |
| Other owners | 265 |