- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/01 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
Patent holdings for IPC class H01L 27/01
Total number of patents in this class: 592
10-year publication summary
|
45
|
51
|
45
|
50
|
42
|
45
|
35
|
30
|
8
|
1
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48760 |
69 |
| GLOBALFOUNDRIES U.S. Inc. | 6389 |
33 |
| Qualcomm Incorporated | 93172 |
31 |
| Texas Instruments Incorporated | 19639 |
25 |
| International Business Machines Corporation | 62769 |
20 |
| Rohm Co., Ltd. | 6898 |
19 |
| Samsung Electronics Co., Ltd. | 158842 |
18 |
| Murata Manufacturing Co., Ltd. | 25893 |
18 |
| Boe Technology Group Co., Ltd. | 44549 |
17 |
| Micron Technology, Inc. | 27726 |
13 |
| Intel Corporation | 46449 |
12 |
| Samsung Display Co., Ltd. | 39012 |
11 |
| Renesas Electronics Corporation | 5860 |
10 |
| Unisantis Electronics Singapore Pte. Ltd. | 664 |
9 |
| Apple Inc. | 59177 |
8 |
| Semiconductor Energy Laboratory Co., Ltd. | 11890 |
7 |
| Infineon Technologies AG | 8418 |
7 |
| United Microelectronics Corp. | 4516 |
7 |
| Advanced Semiconductor Engineering, Inc. | 1755 |
7 |
| Semiconductor Components Industries, L.L.C. | 5261 |
6 |
| Other owners | 245 |