- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
Patent holdings for IPC class H01L 29/06
Total number of patents in this class: 28774
10-year publication summary
|
3079
|
2841
|
2648
|
2299
|
2095
|
2186
|
1985
|
2417
|
1826
|
251
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46877 |
5207 |
| International Business Machines Corporation | 62076 |
1980 |
| Samsung Electronics Co., Ltd. | 152534 |
1912 |
| Intel Corporation | 46625 |
1060 |
| Fuji Electric Co., Ltd. | 5359 |
811 |
| GLOBALFOUNDRIES U.S. Inc. | 6401 |
737 |
| United Microelectronics Corp. | 4418 |
574 |
| Rohm Co., Ltd. | 6711 |
543 |
| Infineon Technologies AG | 8343 |
499 |
| Mitsubishi Electric Corporation | 47461 |
439 |
| Texas Instruments Incorporated | 19587 |
401 |
| Toshiba Corporation | 12684 |
400 |
| Infineon Technologies Austria AG | 2276 |
369 |
| Renesas Electronics Corporation | 5881 |
350 |
| Denso Corporation | 25074 |
340 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1740 |
327 |
| Semiconductor Components Industries, L.L.C. | 5274 |
272 |
| Micron Technology, Inc. | 27235 |
250 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1033 |
216 |
| Adeia Semiconductor Solutions LLC | 757 |
207 |
| Other owners | 11880 |