- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/165 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System in uncombined form including two or more of the elements provided for in group in different semiconductor regions
Patent holdings for IPC class H01L 29/165
Total number of patents in this class: 3021
10-year publication summary
|
490
|
467
|
377
|
399
|
353
|
211
|
158
|
115
|
106
|
4
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40608 |
1098 |
| Samsung Electronics Co., Ltd. | 139001 |
317 |
| International Business Machines Corporation | 60129 |
268 |
| Intel Corporation | 46126 |
185 |
| GLOBALFOUNDRIES U.S. Inc. | 6433 |
140 |
| United Microelectronics Corp. | 4106 |
108 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1773 |
83 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1032 |
50 |
| Institute of Microelectronics, Chinese Academy of Sciences | 1344 |
33 |
| Daedalus Prime LLC | 105 |
31 |
| Marlin Semiconductor Limited | 452 |
30 |
| STMicroelectronics International N.V. | 2815 |
29 |
| STMicroelectronics, Inc. | 298 |
28 |
| Tahoe Research, Ltd. | 2054 |
21 |
| Tessera, Inc. | 634 |
20 |
| Micron Technology, Inc. | 25824 |
19 |
| Texas Instruments Incorporated | 19432 |
18 |
| Bell Semiconductor, LLC | 328 |
17 |
| Sony Corporation | 31541 |
16 |
| National Taiwan University | 1169 |
16 |
| Other owners | 494 |