- All sections
- H - Electricity
- H10B - Electronic memory devices
- H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
Patent holdings for IPC class H10B 43/27
Total number of patents in this class: 4362
10-year publication summary
|
0
|
0
|
3
|
18
|
292
|
861
|
860
|
1087
|
978
|
262
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 152534 |
954 |
| Kioxia Corporation | 10680 |
634 |
| Micron Technology, Inc. | 27235 |
549 |
| SK Hynix Inc. | 12014 |
547 |
| Yangtze Memory Technologies Co., Ltd. | 3097 |
498 |
| Sandisk Technologies Inc. | 5317 |
369 |
| Lodestar Licensing Group LLC | 1163 |
130 |
| Macronix International Co., Ltd. | 2522 |
94 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46877 |
81 |
| JPMorgan Chase Bank, N.A., AS The Agent | 2657 |
58 |
| Applied Materials, Inc. | 19863 |
53 |
| Semiconductor Energy Laboratory Co., Ltd. | 11643 |
36 |
| Sunrise Memory Corporation | 214 |
35 |
| Sandisk Technologies LLC | 1451 |
33 |
| IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) | 1511 |
29 |
| Tokyo Electron Limited | 13459 |
23 |
| Lam Research Corporation | 5479 |
20 |
| Intel NDTM US LLC | 451 |
20 |
| Institute of Microelectronics, Chinese Academy of Sciences | 1416 |
18 |
| Monolithic 3D Inc. | 328 |
18 |
| Other owners | 163 |