- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/005 - Control means for lapping machines or devices
Patent holdings for IPC class B24B 37/005
Total number of patents in this class: 737
10-year publication summary
|
34
|
41
|
53
|
68
|
64
|
74
|
61
|
73
|
75
|
49
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 2329 |
181 |
| Applied Materials, Inc. | 20406 |
179 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48438 |
68 |
| Sumco Corporation | 1109 |
29 |
| Samsung Electronics Co., Ltd. | 157946 |
18 |
| Shin-Etsu Handotai Co., Ltd. | 1306 |
15 |
| Disco Corporation | 1956 |
12 |
| Tokyo Electron Limited | 13824 |
10 |
| Illinois Tool Works Inc. | 11866 |
7 |
| Seagate Technology LLC | 3958 |
7 |
| Fujikoshi Machinery Corp. | 54 |
7 |
| Kioxia Corporation | 10823 |
7 |
| Axus Technology, LLC | 16 |
5 |
| Globalwafers Co., Ltd. | 730 |
5 |
| K.C. Tech Co., Ltd. | 97 |
5 |
| Changxin Memory Technologies, Inc. | 4933 |
5 |
| Hangzhou Sizone Electronic Technology Inc. | 83 |
5 |
| II-VI Delaware, Inc. | 1623 |
4 |
| National University Corporation Nagaoka University of Technology | 148 |
4 |
| Siltronic AG | 434 |
4 |
| Other owners | 160 |