- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/005 - Control means for lapping machines or devices
Patent holdings for IPC class B24B 37/005
Total number of patents in this class: 718
10-year publication summary
|
34
|
41
|
53
|
68
|
63
|
73
|
61
|
72
|
75
|
33
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 19999 |
177 |
| Ebara Corporation | 2271 |
176 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47211 |
65 |
| Sumco Corporation | 1114 |
29 |
| Samsung Electronics Co., Ltd. | 153573 |
16 |
| Shin-Etsu Handotai Co., Ltd. | 1301 |
15 |
| Tokyo Electron Limited | 13513 |
10 |
| Disco Corporation | 1929 |
10 |
| Illinois Tool Works Inc. | 11722 |
7 |
| Seagate Technology LLC | 3994 |
7 |
| Fujikoshi Machinery Corp. | 55 |
7 |
| Kioxia Corporation | 10706 |
7 |
| Axus Technology, LLC | 30 |
5 |
| Globalwafers Co., Ltd. | 719 |
5 |
| K.C. Tech Co., Ltd. | 92 |
5 |
| Changxin Memory Technologies, Inc. | 4924 |
5 |
| Hangzhou Sizone Electronic Technology Inc. | 79 |
5 |
| II-VI Delaware, Inc. | 1626 |
4 |
| Siltronic AG | 428 |
4 |
| Agc, Inc. | 5285 |
4 |
| Other owners | 155 |