- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 37/005 - Control means for lapping machines or devices
Patent holdings for IPC class B24B 37/005
Total number of patents in this class: 600
10-year publication summary
|
49
|
34
|
41
|
53
|
68
|
63
|
70
|
59
|
68
|
1
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 2072 |
159 |
| Applied Materials, Inc. | 17676 |
131 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40493 |
60 |
| Sumco Corporation | 1124 |
23 |
| Shin-Etsu Handotai Co., Ltd. | 1285 |
16 |
| Samsung Electronics Co., Ltd. | 138320 |
12 |
| Tokyo Electron Limited | 12067 |
9 |
| Illinois Tool Works Inc. | 11379 |
7 |
| Seagate Technology LLC | 3927 |
7 |
| Fujikoshi Machinery Corp. | 53 |
7 |
| Kioxia Corporation | 10112 |
6 |
| Disco Corporation | 1801 |
5 |
| Changxin Memory Technologies, Inc. | 4912 |
5 |
| Axus Technology, LLC | 31 |
4 |
| Globalwafers Co., Ltd. | 617 |
4 |
| K.C. Tech Co., Ltd. | 78 |
4 |
| Siltronic AG | 411 |
4 |
| DuPont Electronic Materials Holding, Inc. | 177 |
4 |
| JPMorgan Chase Bank, National Association | 8399 |
3 |
| Cabot Microelectronics Corporation | 205 |
3 |
| Other owners | 127 |