- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/005 - Control means for lapping machines or devices
Patent holdings for IPC class B24B 37/005
Total number of patents in this class: 693
10-year publication summary
|
34
|
41
|
53
|
68
|
63
|
73
|
61
|
70
|
75
|
10
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 2248 |
172 |
| Applied Materials, Inc. | 19531 |
168 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46469 |
64 |
| Sumco Corporation | 1115 |
28 |
| Samsung Electronics Co., Ltd. | 150751 |
15 |
| Shin-Etsu Handotai Co., Ltd. | 1292 |
15 |
| Tokyo Electron Limited | 13324 |
10 |
| Disco Corporation | 1919 |
9 |
| Illinois Tool Works Inc. | 11645 |
7 |
| Seagate Technology LLC | 3988 |
7 |
| Fujikoshi Machinery Corp. | 55 |
7 |
| Kioxia Corporation | 10505 |
6 |
| Axus Technology, LLC | 37 |
5 |
| K.C. Tech Co., Ltd. | 90 |
5 |
| Changxin Memory Technologies, Inc. | 4925 |
5 |
| Hangzhou Sizone Electronic Technology Inc. | 77 |
5 |
| Globalwafers Co., Ltd. | 707 |
4 |
| II-VI Delaware, Inc. | 1642 |
4 |
| Siltronic AG | 426 |
4 |
| DuPont Electronic Materials Holding, Inc. | 207 |
4 |
| Other owners | 149 |