- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/07 - Lapping machines or devicesAccessories designed for working plane surfaces characterised by the movement of the work or lapping tool
Patent holdings for IPC class B24B 37/07
Total number of patents in this class: 34
10-year publication summary
|
3
|
6
|
1
|
4
|
4
|
5
|
4
|
2
|
1
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 2371 |
4 |
| Applied Materials, Inc. | 20601 |
3 |
| Shin-Etsu Handotai Co., Ltd. | 1305 |
3 |
| Hangzhou Sizone Electronic Technology Inc. | 90 |
3 |
| Samsung Display Co., Ltd. | 39154 |
2 |
| Tokyo Electron Limited | 13956 |
2 |
| Nippon Electric Glass Co., Ltd. | 2569 |
2 |
| Sunsea Telecommunications Co., Ltd. | 75 |
2 |
| Samsung Electronics Co., Ltd. | 159298 |
1 |
| Apple Inc. | 59354 |
1 |
| JPMorgan Chase Bank, National Association | 8970 |
1 |
| Dalian University of Technology | 1608 |
1 |
| II-VI Delaware, Inc. | 1621 |
1 |
| K.C. Tech Co., Ltd. | 98 |
1 |
| Siltronic AG | 439 |
1 |
| Sumco Corporation | 1108 |
1 |
| Toho Engineering Co., Ltd. | 7 |
1 |
| Huaqiao University | 81 |
1 |
| Qualtec. Co., Ltd. | 11 |
1 |
| Tohokoki Seisakusho Co., Ltd. | 3 |
1 |
| Other owners | 1 |