- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/08 - Lapping machines or devicesAccessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
Patent holdings for IPC class B24B 37/08
Total number of patents in this class: 217
10-year publication summary
|
10
|
13
|
14
|
19
|
19
|
15
|
16
|
16
|
18
|
11
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Shin-Etsu Handotai Co., Ltd. | 1288 |
53 |
| Sumco Corporation | 1114 |
48 |
| Siltronic AG | 423 |
15 |
| Hoya Corporation | 2759 |
12 |
| Globalwafers Co., Ltd. | 651 |
7 |
| LG Siltron Inc. | 116 |
6 |
| Sumitomo Electric Industries, Ltd. | 15668 |
4 |
| Lapmaster Wolters GmbH | 37 |
4 |
| Supfina Grieshaber GmbH & Co. KG | 75 |
4 |
| SK Siltron Co., Ltd. | 165 |
4 |
| Agc, Inc. | 4949 |
4 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44095 |
3 |
| Disco Corporation | 1876 |
3 |
| Fujikoshi Machinery Corp. | 54 |
3 |
| Shin-Etsu Chemical Co., Ltd. | 5715 |
2 |
| Mitsui Chemicals, Inc. | 3235 |
2 |
| Sumco TECHXIV Corporation | 100 |
2 |
| Toyo Kohan Co., Ltd. | 421 |
2 |
| Ahiko Finetec,ltd. | 2 |
2 |
| Xi'an Eswin Material Technology Co., Ltd. | 79 |
2 |
| Other owners | 35 |