- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Patent holdings for IPC class B24B 53/017
Total number of patents in this class: 540
10-year publication summary
|
29
|
51
|
44
|
46
|
40
|
50
|
56
|
53
|
80
|
5
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 19577 |
87 |
| Ebara Corporation | 2249 |
83 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46507 |
82 |
| Samsung Electronics Co., Ltd. | 151017 |
27 |
| 3m Innovative Properties Company | 17614 |
15 |
| Kinik Company | 36 |
15 |
| Entegris, Inc. | 1946 |
12 |
| Shin-Etsu Handotai Co., Ltd. | 1290 |
11 |
| Hangzhou Sizone Electronic Technology Inc. | 78 |
9 |
| Ehwa Diamond Industrial Co., Ltd. | 61 |
7 |
| Saesol Diamond Ind. Co., Ltd. | 11 |
7 |
| Kioxia Corporation | 10512 |
7 |
| DuPont Electronic Materials Holding, Inc. | 207 |
7 |
| Tokyo Electron Limited | 13336 |
6 |
| Seagate Technology LLC | 3986 |
6 |
| Sumco Corporation | 1112 |
6 |
| Disco Corporation | 1917 |
5 |
| Enpulse Co., Ltd. | 69 |
5 |
| Fujikoshi Machinery Corp. | 55 |
4 |
| Globalwafers Co., Ltd. | 712 |
4 |
| Other owners | 135 |