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  • All sections
  • C - Chemistrymetallurgy
  • C23F - Non-mechanical removal of metallic material from surfacesinhibiting corrosion of metallic materialinhibiting incrustation in generalmulti-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
  • C23F 1/00 - Etching metallic material by chemical means

Patent holdings for IPC class C23F 1/00

Total number of patents in this class: 1673

10-year publication summary

109
69
46
28
21
22
13
17
18
1
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Tokyo Electron Limited
13336
238
Applied Materials, Inc.
19577
147
Lam Research Corporation
5429
132
Hitachi High-Tech Corporation
5564
33
Samsung Electronics Co., Ltd.
151017
26
Taiwan Semiconductor Manufacturing Company, Ltd.
46507
25
Samsung Display Co., Ltd.
37127
21
Novellus Systems, Inc.
466
20
Kokusai Electric Corporation
2149
20
Micron Technology, Inc.
27174
18
Varian Semiconductor Equipment Associates, Inc.
1214
15
Kioxia Corporation
10512
14
Dai Nippon Printing Co., Ltd.
4169
13
United Microelectronics Corp.
4369
11
ASM IP Holding B.V.
2216
11
Screen Holdings Co., Ltd.
3002
11
The Regents of the University of California
20355
10
Texas Instruments Incorporated
19555
10
CMC Materials LLC
246
10
JFE Steel Corporation
7163
8
Other owners 880

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