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  • All sections
  • C - Chemistrymetallurgy
  • C23F - Non-mechanical removal of metallic material from surfacesinhibiting corrosion of metallic materialinhibiting incrustation in generalmulti-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
  • C23F 1/00 - Etching metallic material by chemical means

Patent holdings for IPC class C23F 1/00

Total number of patents in this class: 1622

10-year publication summary

109
70
46
29
21
22
13
18
18
5
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Tokyo Electron Limited
13796
233
Applied Materials, Inc.
20363
135
Lam Research Corporation
5621
126
Hitachi High-Tech Corporation
5819
33
Taiwan Semiconductor Manufacturing Company, Ltd.
48248
26
Samsung Electronics Co., Ltd.
157557
25
Samsung Display Co., Ltd.
38570
21
Kokusai Electric Corporation
2215
20
Novellus Systems, Inc.
452
19
Micron Technology, Inc.
27626
17
Varian Semiconductor Equipment Associates, Inc.
1187
15
Kioxia Corporation
10805
14
Dai Nippon Printing Co., Ltd.
4237
13
United Microelectronics Corp.
4492
11
ASM IP Holding B.V.
2387
11
Screen Holdings Co., Ltd.
3148
11
The Regents of the University of California
20720
10
CMC Materials LLC
244
10
Texas Instruments Incorporated
19663
9
JFE Steel Corporation
7508
8
Other owners 855

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