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  • All sections
  • C - Chemistrymetallurgy
  • C23F - Non-mechanical removal of metallic material from surfacesinhibiting corrosion of metallic materialinhibiting incrustation in generalmulti-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
  • C23F 1/00 - Etching metallic material by chemical means

Patent holdings for IPC class C23F 1/00

Total number of patents in this class: 1724

10-year publication summary

147
109
70
46
29
21
21
13
17
11
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Tokyo Electron Limited
12712
246
Applied Materials, Inc.
18621
156
Lam Research Corporation
5239
137
Hitachi High-Tech Corporation
5310
33
Samsung Electronics Co., Ltd.
146092
26
Taiwan Semiconductor Manufacturing Company, Ltd.
42704
25
Samsung Display Co., Ltd.
34696
23
Novellus Systems, Inc.
483
22
Kokusai Electric Corporation
2018
20
Micron Technology, Inc.
26262
19
Varian Semiconductor Equipment Associates, Inc.
1231
15
Kioxia Corporation
10290
14
ASM IP Holding B.V.
2077
13
Dai Nippon Printing Co., Ltd.
4082
12
Screen Holdings Co., Ltd.
2814
12
United Microelectronics Corp.
4268
11
CMC Materials LLC
246
11
The Regents of the University of California
19918
10
Texas Instruments Incorporated
19470
10
Jusung Engineering Co., Ltd.
442
8
Other owners 901

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