- All sections
- C - Chemistrymetallurgy
- C25D - Processes for the electrolytic or electrophoretic production of coatingselectroformingjoining workpieces by electrolysisapparatus therefor
- C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
Patent holdings for IPC class C25D 3/38
Total number of patents in this class: 1331
10-year publication summary
|
128
|
116
|
121
|
128
|
110
|
109
|
110
|
130
|
136
|
60
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Atotech Deutschland GmbH | 556 |
57 |
| BASF SE | 20933 |
50 |
| DuPont Electronic Materials International, LLC | 429 |
48 |
| JX Nippon Mining & Metals Corporation | 1489 |
46 |
| Lam Research Corporation | 5239 |
43 |
| MacDermid Enthone Inc. | 239 |
39 |
| SK Nexilis Co., Ltd. | 77 |
37 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42704 |
25 |
| Novellus Systems, Inc. | 483 |
22 |
| Applied Materials, Inc. | 18621 |
21 |
| Chang Chun Petrochemical Co., Ltd. | 114 |
20 |
| Lotte Energy Materials Corporation | 40 |
17 |
| Alchimer | 51 |
14 |
| Suzhou Shinhao Materials LLC | 14 |
14 |
| The Furukawa Electric Co., Ltd. | 3650 |
13 |
| Toyota Motor Corporation | 32116 |
12 |
| C. Uyemura & Co., Ltd. | 163 |
12 |
| Atotech Deutschland GmbH & Co. KG | 374 |
12 |
| Ebara Corporation | 2169 |
11 |
| Mitsui Mining & Smelting Co., Ltd. | 1482 |
11 |
| Other owners | 807 |