- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/463 - Mechanical treatment, e.g. grinding, ultrasonic treatment
Patent holdings for IPC class H01L 21/463
Total number of patents in this class: 96
10-year publication summary
|
6
|
4
|
5
|
9
|
9
|
5
|
13
|
15
|
6
|
4
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42549 |
9 |
| Semiconductor Energy Laboratory Co., Ltd. | 11388 |
6 |
| Disco Corporation | 1851 |
4 |
| BASF SE | 20912 |
3 |
| International Business Machines Corporation | 61198 |
3 |
| Applied Materials, Inc. | 18565 |
3 |
| Infineon Technologies AG | 8218 |
3 |
| Lapis Semiconductor Co., Ltd. | 889 |
3 |
| Samsung Electronics Co., Ltd. | 145630 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 31273 |
2 |
| Ebara Corporation | 2166 |
2 |
| Advanced Semiconductor Engineering, Inc. | 1645 |
2 |
| SunEdison Semiconductor Limited | 47 |
2 |
| Versum Materials US, LLC | 641 |
2 |
| BASF (China) Co., Ltd. | 837 |
2 |
| Agc, Inc. | 4820 |
2 |
| Kioxia Corporation | 10285 |
2 |
| JPMorgan Chase Bank, N.A., AS The Agent | 2516 |
2 |
| Siemens AG | 24518 |
1 |
| Panasonic Corporation | 20128 |
1 |
| Other owners | 40 |