- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
Patent holdings for IPC class H01L 21/50
Total number of patents in this class: 2119
10-year publication summary
|
101
|
105
|
105
|
123
|
136
|
125
|
113
|
122
|
86
|
1
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46267 |
155 |
| STATS ChipPAC Pte. Lte. | 1548 |
92 |
| Texas Instruments Incorporated | 19497 |
73 |
| Intel Corporation | 46481 |
71 |
| Micron Technology, Inc. | 26672 |
68 |
| Infineon Technologies AG | 8286 |
63 |
| Samsung Electronics Co., Ltd. | 149582 |
45 |
| Advanced Semiconductor Engineering, Inc. | 1684 |
43 |
| International Business Machines Corporation | 61792 |
35 |
| Renesas Electronics Corporation | 5921 |
25 |
| SJ Semiconductor (Jiangyin) Corporation | 155 |
22 |
| Mitsubishi Electric Corporation | 47065 |
21 |
| Semiconductor Components Industries, L.L.C. | 5300 |
20 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 361 |
19 |
| Texas Instruments Japan, Ltd. | 1656 |
18 |
| Kioxia Corporation | 10472 |
18 |
| Applied Materials, Inc. | 19361 |
17 |
| Shinko Electric Industries Co., Ltd. | 1217 |
17 |
| Huawei Technologies Co., Ltd. | 116370 |
15 |
| Shenzhen Xinguodu Technology Co., Ltd. | 2141 |
14 |
| Other owners | 1268 |