- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
Patent holdings for IPC class H01L 21/50
Total number of patents in this class: 2087
10-year publication summary
|
101
|
106
|
106
|
123
|
136
|
125
|
112
|
121
|
87
|
46
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48861 |
165 |
| Intel Corporation | 46292 |
69 |
| Texas Instruments Incorporated | 19644 |
68 |
| Micron Technology, Inc. | 27793 |
64 |
| Infineon Technologies AG | 8419 |
63 |
| STATS ChipPAC Pte. Lte. | 972 |
52 |
| Samsung Electronics Co., Ltd. | 159029 |
41 |
| Advanced Semiconductor Engineering, Inc. | 1761 |
41 |
| International Business Machines Corporation | 62805 |
36 |
| STATS ChipPAC Management Pte. Ltd. | 542 |
34 |
| SJ Semiconductor (Jiangyin) Corporation | 179 |
28 |
| Renesas Electronics Corporation | 5855 |
21 |
| Mitsubishi Electric Corporation | 48351 |
21 |
| Semiconductor Components Industries, L.L.C. | 5265 |
19 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 357 |
19 |
| Texas Instruments Japan, Ltd. | 1656 |
18 |
| Applied Materials, Inc. | 20579 |
17 |
| Shinko Electric Industries Co., Ltd. | 1246 |
17 |
| Huawei Technologies Co., Ltd. | 124837 |
16 |
| Kioxia Corporation | 11017 |
16 |
| Other owners | 1262 |