- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
Patent holdings for IPC class H01L 21/768
Total number of patents in this class: 27351
10-year publication summary
|
2369
|
2532
|
2610
|
2728
|
2407
|
2382
|
2228
|
2128
|
1932
|
169
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46507 |
6489 |
| International Business Machines Corporation | 61904 |
1456 |
| Samsung Electronics Co., Ltd. | 151017 |
1427 |
| Applied Materials, Inc. | 19577 |
1080 |
| Intel Corporation | 46576 |
953 |
| Micron Technology, Inc. | 27174 |
895 |
| Tokyo Electron Limited | 13336 |
697 |
| GLOBALFOUNDRIES U.S. Inc. | 6404 |
649 |
| Nanya Technology Corporation | 2738 |
500 |
| United Microelectronics Corp. | 4369 |
456 |
| Changxin Memory Technologies, Inc. | 4925 |
416 |
| Kioxia Corporation | 10512 |
399 |
| SK Hynix Inc. | 11871 |
395 |
| Sony Semiconductor Solutions Corporation | 11018 |
357 |
| Lam Research Corporation | 5429 |
349 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1745 |
274 |
| Yangtze Memory Technologies Co., Ltd. | 3035 |
259 |
| Sandisk Technologies Inc. | 5176 |
258 |
| Qualcomm Incorporated | 88555 |
256 |
| Adeia Semiconductor Solutions LLC | 757 |
232 |
| Other owners | 9554 |