- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/32 - Semiconductor bodies having polished or roughened surface the imperfections being within the semiconductor body
Patent holdings for IPC class H01L 29/32
Total number of patents in this class: 549
10-year publication summary
|
76
|
75
|
67
|
45
|
35
|
29
|
23
|
27
|
7
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fuji Electric Co., Ltd. | 5511 |
128 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48560 |
41 |
| Infineon Technologies AG | 8410 |
40 |
| Denso Corporation | 25645 |
23 |
| Toshiba Corporation | 12594 |
17 |
| Rohm Co., Ltd. | 6877 |
17 |
| Mitsubishi Electric Corporation | 48172 |
16 |
| Infineon Technologies Austria AG | 2345 |
12 |
| GLOBALFOUNDRIES U.S. Inc. | 6380 |
11 |
| Sixpoint Materials, Inc. | 78 |
11 |
| International Business Machines Corporation | 62748 |
10 |
| Sumitomo Electric Industries, Ltd. | 16448 |
8 |
| Intel Corporation | 47178 |
7 |
| Sumco Corporation | 1109 |
7 |
| Semiconductor Components Industries, L.L.C. | 5253 |
6 |
| Globalwafers Co., Ltd. | 730 |
6 |
| Shin-Etsu Handotai Co., Ltd. | 1307 |
6 |
| Toshiba Electronic Devices & Storage Corporation | 2339 |
6 |
| Resonac Corporation | 3610 |
6 |
| Mediatek Inc. | 5379 |
5 |
| Other owners | 166 |