- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/32 - Semiconductor bodies having polished or roughened surface the imperfections being within the semiconductor body
Patent holdings for IPC class H01L 29/32
Total number of patents in this class: 569
10-year publication summary
88
|
76
|
75
|
67
|
45
|
36
|
38
|
32
|
30
|
1
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Fuji Electric Co., Ltd. | 5057 |
141 |
Infineon Technologies AG | 8181 |
42 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 41550 |
42 |
Denso Corporation | 24007 |
23 |
Mitsubishi Electric Corporation | 45414 |
20 |
Rohm Co., Ltd. | 6401 |
17 |
Toshiba Corporation | 12246 |
16 |
Infineon Technologies Austria AG | 2106 |
13 |
GLOBALFOUNDRIES U.S. Inc. | 6439 |
11 |
International Business Machines Corporation | 60597 |
10 |
Sumitomo Electric Industries, Ltd. | 15202 |
9 |
Intel Corporation | 46597 |
7 |
Seoul Semiconductor Co., Ltd. | 1068 |
7 |
Sumco Corporation | 1122 |
7 |
Semiconductor Components Industries, L.L.C. | 5240 |
6 |
Globalwafers Co., Ltd. | 633 |
6 |
Shin-Etsu Handotai Co., Ltd. | 1291 |
6 |
Toshiba Electronic Devices & Storage Corporation | 1900 |
5 |
3-5 Power Electronics GmbH | 19 |
5 |
Daedalus Prime LLC | 105 |
5 |
Other owners | 171 |