- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 1/00 - Processes of grinding or polishingUse of auxiliary equipment in connection with such processes
Patent holdings for IPC class B24B 1/00
Total number of patents in this class: 1240
10-year publication summary
|
49
|
67
|
62
|
56
|
69
|
61
|
54
|
41
|
45
|
24
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| 3m Innovative Properties Company | 17478 |
39 |
| Applied Materials, Inc. | 20375 |
34 |
| Disco Corporation | 1956 |
32 |
| Hoya Corporation | 2721 |
24 |
| DuPont Electronic Materials Holding, Inc. | 202 |
24 |
| Saint-Gobain Abrasifs | 620 |
23 |
| Saint-Gobain Abrasives, Inc. | 864 |
23 |
| Ebara Corporation | 2323 |
22 |
| Essilor International (compagnie Generale D'optique) | 2994 |
22 |
| Sumco Corporation | 1111 |
21 |
| Corning Incorporated | 10504 |
20 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48302 |
19 |
| CMC Materials LLC | 244 |
18 |
| Shin-Etsu Chemical Co., Ltd. | 6096 |
15 |
| Fujimi Incorporated | 802 |
15 |
| Shin-Etsu Handotai Co., Ltd. | 1307 |
14 |
| Dalian University of Technology | 1594 |
12 |
| Tokyo Electron Limited | 13807 |
10 |
| University of Florida Research Foundation, Inc. | 4174 |
9 |
| Samsung Electronics Co., Ltd. | 157719 |
8 |
| Other owners | 836 |