- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 1/00 - Processes of grinding or polishingUse of auxiliary equipment in connection with such processes
Patent holdings for IPC class B24B 1/00
Total number of patents in this class: 1244
10-year publication summary
|
49
|
67
|
62
|
56
|
69
|
61
|
51
|
40
|
43
|
17
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| 3m Innovative Properties Company | 17507 |
39 |
| Applied Materials, Inc. | 20085 |
35 |
| Disco Corporation | 1934 |
32 |
| DuPont Electronic Materials Holding, Inc. | 207 |
25 |
| Hoya Corporation | 2736 |
24 |
| Essilor International (compagnie Generale D'optique) | 2962 |
24 |
| Saint-Gobain Abrasifs | 627 |
24 |
| Saint-Gobain Abrasives, Inc. | 867 |
24 |
| Ebara Corporation | 2275 |
22 |
| Sumco Corporation | 1113 |
21 |
| Corning Incorporated | 10421 |
20 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47518 |
19 |
| CMC Materials LLC | 245 |
18 |
| Shin-Etsu Chemical Co., Ltd. | 5966 |
15 |
| Fujimi Incorporated | 796 |
15 |
| Shin-Etsu Handotai Co., Ltd. | 1302 |
14 |
| Dalian University of Technology | 1572 |
12 |
| Tokyo Electron Limited | 13561 |
10 |
| Samsung Electronics Co., Ltd. | 154406 |
8 |
| University of Florida Research Foundation, Inc. | 4150 |
8 |
| Other owners | 835 |