- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 1/00 - Processes of grinding or polishingUse of auxiliary equipment in connection with such processes
Patent holdings for IPC class B24B 1/00
Total number of patents in this class: 1244
10-year publication summary
|
49
|
67
|
62
|
56
|
69
|
62
|
54
|
44
|
45
|
34
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| 3m Innovative Properties Company | 17443 |
39 |
| Applied Materials, Inc. | 20625 |
34 |
| Disco Corporation | 1965 |
30 |
| DuPont Electronic Materials Holding, Inc. | 200 |
24 |
| Saint-Gobain Abrasifs | 613 |
23 |
| Saint-Gobain Abrasives, Inc. | 855 |
23 |
| Hoya Corporation | 2400 |
22 |
| Ebara Corporation | 2379 |
22 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49324 |
21 |
| Essilor International (compagnie Generale D'optique) | 3001 |
21 |
| Sumco Corporation | 1108 |
21 |
| Corning Incorporated | 10558 |
20 |
| CMC Materials LLC | 244 |
18 |
| Shin-Etsu Chemical Co., Ltd. | 6157 |
16 |
| Fujimi Incorporated | 836 |
15 |
| Shin-Etsu Handotai Co., Ltd. | 1306 |
14 |
| Dalian University of Technology | 1611 |
12 |
| Tokyo Electron Limited | 13987 |
10 |
| University of Florida Research Foundation, Inc. | 4223 |
9 |
| FUJIFILM Electronic Materials U.S.A., Inc. | 354 |
9 |
| Other owners | 841 |