- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/013 - Devices or means for detecting lapping completion
Patent holdings for IPC class B24B 37/013
Total number of patents in this class: 513
10-year publication summary
|
26
|
32
|
60
|
33
|
36
|
43
|
37
|
43
|
41
|
41
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20406 |
164 |
| Ebara Corporation | 2329 |
142 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48438 |
34 |
| Sumco Corporation | 1109 |
16 |
| Kioxia Corporation | 10823 |
12 |
| Samsung Electronics Co., Ltd. | 157946 |
9 |
| Fujibo Holdings, Inc. | 109 |
9 |
| Shin-Etsu Handotai Co., Ltd. | 1306 |
9 |
| Disco Corporation | 1956 |
8 |
| DDP Specialty Electronic Materials US, LLC | 843 |
7 |
| Seagate Technology LLC | 3958 |
6 |
| Toyo Tire & Rubber Co., Ltd. | 487 |
6 |
| Beijing TSD Semiconductor Co., Ltd. | 10 |
6 |
| Bruker Nano, Inc. | 381 |
4 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 77 |
4 |
| Micron Technology, Inc. | 27675 |
3 |
| Tokyo Electron Limited | 13824 |
3 |
| Headway Technologies, Inc. | 683 |
3 |
| SK Siltron Co., Ltd. | 173 |
3 |
| Hangzhou Sizone Electronic Technology Inc. | 83 |
3 |
| Other owners | 62 |