- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/16 - Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
Patent holdings for IPC class B24B 37/16
Total number of patents in this class: 63
10-year publication summary
|
8
|
8
|
10
|
6
|
4
|
2
|
6
|
2
|
2
|
1
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48760 |
9 |
| Ebara Corporation | 2349 |
6 |
| CMC Materials LLC | 244 |
6 |
| 3m Innovative Properties Company | 17445 |
5 |
| Applied Materials, Inc. | 20552 |
5 |
| Seagate Technology LLC | 3964 |
4 |
| II-VI Delaware, Inc. | 1618 |
4 |
| ASML Netherlands B.V. | 8005 |
3 |
| SK Siltron Co., Ltd. | 176 |
2 |
| Wolfspeed, Inc. | 910 |
2 |
| Tianjin Chuangjin Jinggong Technology Co., Ltd. | 2 |
2 |
| Tokyo Electron Limited | 13920 |
1 |
| Shin-Etsu Chemical Co., Ltd. | 6134 |
1 |
| National Institute of Advanced Industrial Science and Technology | 3790 |
1 |
| Carl Zeiss SMT GmbH | 3364 |
1 |
| Entegris, Inc. | 2023 |
1 |
| Fujikoshi Machinery Corp. | 54 |
1 |
| Japan Agency for Marine-Earth Science and Technology | 173 |
1 |
| LG Siltron Inc. | 116 |
1 |
| M Cubed Technologies, Inc. | 12 |
1 |
| Other owners | 6 |