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  • All sections
  • B - Performing operationstransporting
  • B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
  • B24B 37/20 - Lapping pads for working plane surfaces

Patent holdings for IPC class B24B 37/20

Total number of patents in this class: 526

10-year publication summary

39
82
56
61
50
49
51
33
32
24
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Applied Materials, Inc.
18861
104
Taiwan Semiconductor Manufacturing Company, Ltd.
43258
74
Ebara Corporation
2182
69
CMC Materials LLC
250
20
Samsung Electronics Co., Ltd.
147501
16
Enpulse Co., Ltd.
68
16
Toyo Tire & Rubber Co., Ltd.
534
14
DDP Specialty Electronic Materials US, LLC
839
13
DuPont Electronic Materials Holding, Inc.
210
11
Rohm and Haas Electronic Materials CMP Holdings, Inc.
72
9
Shin-Etsu Handotai Co., Ltd.
1283
7
Tokyo Electron Limited
12877
6
NexPlanar Corporation
15
6
Sumco Corporation
1113
6
Kioxia Corporation
10387
6
Disco Corporation
1869
5
IV Technologies Co., Ltd.
38
5
Samsung Display Co., Ltd.
35171
4
K.C. Tech Co., Ltd.
83
4
Nitta Haas Incorporated
70
4
Other owners 127

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