- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/20 - Lapping pads for working plane surfaces
Patent holdings for IPC class B24B 37/20
Total number of patents in this class: 526
10-year publication summary
39
|
82
|
56
|
61
|
50
|
49
|
51
|
33
|
32
|
24
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Applied Materials, Inc. | 18861 |
104 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 43258 |
74 |
Ebara Corporation | 2182 |
69 |
CMC Materials LLC | 250 |
20 |
Samsung Electronics Co., Ltd. | 147501 |
16 |
Enpulse Co., Ltd. | 68 |
16 |
Toyo Tire & Rubber Co., Ltd. | 534 |
14 |
DDP Specialty Electronic Materials US, LLC | 839 |
13 |
DuPont Electronic Materials Holding, Inc. | 210 |
11 |
Rohm and Haas Electronic Materials CMP Holdings, Inc. | 72 |
9 |
Shin-Etsu Handotai Co., Ltd. | 1283 |
7 |
Tokyo Electron Limited | 12877 |
6 |
NexPlanar Corporation | 15 |
6 |
Sumco Corporation | 1113 |
6 |
Kioxia Corporation | 10387 |
6 |
Disco Corporation | 1869 |
5 |
IV Technologies Co., Ltd. | 38 |
5 |
Samsung Display Co., Ltd. | 35171 |
4 |
K.C. Tech Co., Ltd. | 83 |
4 |
Nitta Haas Incorporated | 70 |
4 |
Other owners | 127 |