- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/22 - Lapping pads for working plane surfaces characterised by a multi-layered structure
Patent holdings for IPC class B24B 37/22
Total number of patents in this class: 386
10-year publication summary
|
33
|
44
|
31
|
39
|
30
|
32
|
38
|
27
|
23
|
16
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20375 |
58 |
| Enpulse Co., Ltd. | 79 |
34 |
| 3m Innovative Properties Company | 17478 |
28 |
| DuPont Electronic Materials Holding, Inc. | 202 |
23 |
| Fujibo Holdings, Inc. | 109 |
22 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48302 |
20 |
| CMC Materials LLC | 244 |
15 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 77 |
14 |
| Fujimi Incorporated | 802 |
12 |
| DDP Specialty Electronic Materials US, LLC | 851 |
12 |
| Toyo Tire & Rubber Co., Ltd. | 488 |
11 |
| IV Technologies Co., Ltd. | 38 |
9 |
| Kuraray Co., Ltd. | 3589 |
6 |
| NexPlanar Corporation | 15 |
6 |
| Korea Institute of Industrial Technology | 1029 |
5 |
| Kpx Chemical Co., Ltd. | 22 |
5 |
| Shin-Etsu Handotai Co., Ltd. | 1307 |
5 |
| Chempower Corporation | 24 |
5 |
| Samsung Electronics Co., Ltd. | 157719 |
4 |
| Maruishi Sangyo Co., Ltd. | 10 |
4 |
| Other owners | 88 |