- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Patent holdings for IPC class B24B 37/24
Total number of patents in this class: 810
10-year publication summary
|
71
|
63
|
71
|
61
|
69
|
72
|
75
|
80
|
65
|
42
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 18658 |
80 |
| Fujibo Holdings, Inc. | 103 |
65 |
| DuPont Electronic Materials Holding, Inc. | 211 |
60 |
| Enpulse Co., Ltd. | 68 |
46 |
| 3m Innovative Properties Company | 17819 |
40 |
| Kuraray Co., Ltd. | 3503 |
36 |
| CMC Materials LLC | 246 |
31 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42804 |
26 |
| Toyo Tire & Rubber Co., Ltd. | 542 |
23 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 71 |
21 |
| Tokuyama Corporation | 1392 |
21 |
| Shin-Etsu Handotai Co., Ltd. | 1284 |
18 |
| DDP Specialty Electronic Materials US, LLC | 832 |
17 |
| Fujimi Incorporated | 742 |
13 |
| Kpx Chemical Co., Ltd. | 27 |
12 |
| Cabot Microelectronics Corporation | 198 |
11 |
| Sumco Corporation | 1114 |
10 |
| Korea Advanced Institute of Science and Technology | 4382 |
9 |
| Nitta Haas Incorporated | 70 |
9 |
| Samsung Electronics Co., Ltd. | 146346 |
8 |
| Other owners | 254 |