- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Patent holdings for IPC class B24B 37/24
Total number of patents in this class: 763
10-year publication summary
|
71
|
63
|
71
|
61
|
68
|
72
|
74
|
78
|
64
|
3
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 17696 |
77 |
| Fujibo Holdings, Inc. | 100 |
62 |
| DuPont Electronic Materials Holding, Inc. | 177 |
46 |
| SK Enpulse Co., Ltd. | 112 |
41 |
| 3m Innovative Properties Company | 17955 |
38 |
| Kuraray Co., Ltd. | 3463 |
34 |
| CMC Materials LLC | 251 |
31 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40539 |
25 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 97 |
23 |
| Toyo Tire & Rubber Co., Ltd. | 571 |
23 |
| Tokuyama Corporation | 1340 |
21 |
| Shin-Etsu Handotai Co., Ltd. | 1289 |
18 |
| DDP Specialty Electronic Materials US, LLC | 755 |
17 |
| Fujimi Incorporated | 706 |
13 |
| Cabot Microelectronics Corporation | 205 |
11 |
| Kpx Chemical Co., Ltd. | 24 |
11 |
| Sumco Corporation | 1124 |
10 |
| Nitta Haas Incorporated | 70 |
9 |
| Dow Global Technologies LLC | 10143 |
7 |
| Korea Advanced Institute of Science and Technology | 4178 |
7 |
| Other owners | 239 |