- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Patent holdings for IPC class B24B 37/24
Total number of patents in this class: 829
10-year publication summary
|
71
|
63
|
71
|
61
|
69
|
72
|
75
|
80
|
65
|
63
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 19005 |
80 |
| Fujibo Holdings, Inc. | 106 |
67 |
| DuPont Electronic Materials Holding, Inc. | 209 |
60 |
| Enpulse Co., Ltd. | 69 |
47 |
| 3m Innovative Properties Company | 17762 |
41 |
| Kuraray Co., Ltd. | 3524 |
35 |
| CMC Materials LLC | 248 |
31 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44095 |
28 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 75 |
24 |
| Tokuyama Corporation | 1422 |
21 |
| Toyo Tire & Rubber Co., Ltd. | 532 |
21 |
| Shin-Etsu Handotai Co., Ltd. | 1288 |
18 |
| DDP Specialty Electronic Materials US, LLC | 841 |
17 |
| Fujimi Incorporated | 762 |
13 |
| Kpx Chemical Co., Ltd. | 28 |
13 |
| Cabot Microelectronics Corporation | 190 |
11 |
| Noritake Co., Limited | 268 |
10 |
| Sumco Corporation | 1114 |
10 |
| Samsung Electronics Co., Ltd. | 148077 |
9 |
| Korea Advanced Institute of Science and Technology | 4422 |
9 |
| Other owners | 264 |