- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
Patent holdings for IPC class B24B 7/22
Total number of patents in this class: 583
10-year publication summary
32
|
47
|
48
|
59
|
52
|
53
|
43
|
51
|
51
|
28
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Disco Corporation | 1848 |
109 |
Ebara Corporation | 2148 |
23 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 42222 |
22 |
Sumco Corporation | 1126 |
15 |
Tokyo Electron Limited | 12571 |
14 |
Applied Materials, Inc. | 18433 |
13 |
Ancora S.p.A. | 26 |
12 |
Husqvarna AB | 2905 |
10 |
Shin-Etsu Chemical Co., Ltd. | 5602 |
8 |
Shin-Etsu Handotai Co., Ltd. | 1286 |
8 |
Samsung Electronics Co., Ltd. | 144426 |
7 |
3m Innovative Properties Company | 17855 |
7 |
Semiconductor Components Industries, L.L.C. | 5253 |
7 |
Globalwafers Co., Ltd. | 633 |
7 |
DuPont Electronic Materials Holding, Inc. | 198 |
7 |
Vertical Concrete Polishing Inc. | 8 |
6 |
Hangzhou Sizone Electronic Technology Inc. | 69 |
6 |
Corning Incorporated | 10240 |
5 |
Okamoto Machine Tool Works, Ltd. | 16 |
5 |
Siltronic AG | 424 |
5 |
Other owners | 287 |