- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
Patent holdings for IPC class B24B 7/22
Total number of patents in this class: 597
10-year publication summary
31
|
47
|
47
|
59
|
51
|
52
|
43
|
51
|
51
|
43
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Disco Corporation | 1867 |
110 |
Ebara Corporation | 2176 |
24 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 43064 |
22 |
Sumco Corporation | 1113 |
15 |
Tokyo Electron Limited | 12825 |
14 |
Applied Materials, Inc. | 18792 |
12 |
Ancora S.p.A. | 26 |
12 |
Husqvarna AB | 2919 |
11 |
Samsung Electronics Co., Ltd. | 147131 |
9 |
Shin-Etsu Chemical Co., Ltd. | 5676 |
8 |
Shin-Etsu Handotai Co., Ltd. | 1283 |
8 |
3m Innovative Properties Company | 17813 |
7 |
Semiconductor Components Industries, L.L.C. | 5270 |
7 |
Globalwafers Co., Ltd. | 646 |
7 |
DuPont Electronic Materials Holding, Inc. | 210 |
7 |
Vertical Concrete Polishing Inc. | 8 |
6 |
Hangzhou Sizone Electronic Technology Inc. | 74 |
6 |
Corning Incorporated | 10283 |
5 |
Okamoto Machine Tool Works, Ltd. | 16 |
5 |
Siltronic AG | 423 |
5 |
Other owners | 297 |