- All sections
- C - Chemistrymetallurgy
- C23C - Coating metallic materialcoating material with metallic materialsurface treatment of metallic material by diffusion into the surface, by chemical conversion or substitutioncoating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 16/06 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
Patent holdings for IPC class C23C 16/06
Total number of patents in this class: 1169
10-year publication summary
|
106
|
91
|
88
|
81
|
89
|
83
|
110
|
72
|
89
|
40
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 18383 |
148 |
| Tokyo Electron Limited | 12511 |
86 |
| Lam Research Corporation | 5169 |
71 |
| ASM IP Holding B.V. | 2024 |
55 |
| Kokusai Electric Corporation | 1955 |
26 |
| Entegris, Inc. | 1854 |
23 |
| L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude | 3916 |
20 |
| Rtx Corporation | 9290 |
17 |
| Samsung Electronics Co., Ltd. | 143812 |
13 |
| Novellus Systems, Inc. | 487 |
13 |
| Quantum Elements Development, Inc. | 19 |
12 |
| Adeka Corporation | 1363 |
10 |
| Jusung Engineering Co., Ltd. | 432 |
10 |
| Up Chemical Co., Ltd. | 64 |
10 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42036 |
9 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10818 |
9 |
| ASM International N.V. | 135 |
9 |
| ULVAC, Inc. | 1387 |
9 |
| Micron Technology, Inc. | 26196 |
8 |
| BASF SE | 20758 |
7 |
| Other owners | 604 |