- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
Patent holdings for IPC class H01L 21/285
Total number of patents in this class: 5527
10-year publication summary
|
457
|
529
|
614
|
588
|
476
|
453
|
368
|
390
|
342
|
22
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46507 |
990 |
| Applied Materials, Inc. | 19577 |
553 |
| Tokyo Electron Limited | 13336 |
331 |
| Samsung Electronics Co., Ltd. | 151017 |
197 |
| International Business Machines Corporation | 61904 |
181 |
| Lam Research Corporation | 5429 |
172 |
| Intel Corporation | 46576 |
141 |
| ASM IP Holding B.V. | 2216 |
137 |
| GLOBALFOUNDRIES U.S. Inc. | 6404 |
130 |
| Kokusai Electric Corporation | 2149 |
116 |
| ULVAC, Inc. | 1373 |
86 |
| United Microelectronics Corp. | 4369 |
63 |
| Micron Technology, Inc. | 27174 |
58 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1745 |
55 |
| Texas Instruments Incorporated | 19555 |
47 |
| JX Nippon Mining & Metals Corporation | 1474 |
44 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1034 |
43 |
| Renesas Electronics Corporation | 5903 |
40 |
| SK Hynix Inc. | 11871 |
36 |
| Tanaka Kikinzoku Kogyo K.K. | 574 |
36 |
| Other owners | 2071 |