- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
Patent holdings for IPC class H01L 21/288
Total number of patents in this class: 1486
10-year publication summary
|
203
|
171
|
156
|
153
|
110
|
88
|
69
|
74
|
48
|
1
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40539 |
115 |
| Tokyo Electron Limited | 12090 |
84 |
| Lam Research Corporation | 4983 |
82 |
| Applied Materials, Inc. | 17696 |
63 |
| International Business Machines Corporation | 60075 |
36 |
| Ebara Corporation | 2078 |
31 |
| Novellus Systems, Inc. | 509 |
29 |
| Mitsubishi Electric Corporation | 44738 |
28 |
| Alchimer | 51 |
27 |
| FUJIFILM Corporation | 28506 |
26 |
| Atotech Deutschland GmbH | 566 |
26 |
| Texas Instruments Incorporated | 19405 |
24 |
| Infineon Technologies AG | 8134 |
21 |
| BASF SE | 20387 |
19 |
| Semiconductor Components Industries, L.L.C. | 5242 |
19 |
| Konica Minolta Holdings, Inc. | 1012 |
18 |
| Samsung Electronics Co., Ltd. | 138518 |
17 |
| MacDermid Enthone Inc. | 234 |
17 |
| Micron Technology, Inc. | 25756 |
16 |
| Nikon Corporation | 7128 |
16 |
| Other owners | 772 |