- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
Patent holdings for IPC class H01L 21/288
Total number of patents in this class: 1495
10-year publication summary
|
203
|
171
|
156
|
153
|
110
|
88
|
69
|
74
|
48
|
24
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42288 |
118 |
| Tokyo Electron Limited | 12599 |
83 |
| Lam Research Corporation | 5217 |
82 |
| Applied Materials, Inc. | 18475 |
63 |
| International Business Machines Corporation | 61144 |
36 |
| Ebara Corporation | 2160 |
31 |
| Mitsubishi Electric Corporation | 45899 |
28 |
| Novellus Systems, Inc. | 485 |
28 |
| Alchimer | 51 |
27 |
| FUJIFILM Corporation | 29273 |
26 |
| Atotech Deutschland GmbH | 559 |
26 |
| Texas Instruments Incorporated | 19481 |
24 |
| Infineon Technologies AG | 8210 |
22 |
| Semiconductor Components Industries, L.L.C. | 5252 |
21 |
| BASF SE | 20874 |
20 |
| Nikon Corporation | 7166 |
20 |
| Konica Minolta Holdings, Inc. | 931 |
18 |
| Samsung Electronics Co., Ltd. | 144675 |
17 |
| Micron Technology, Inc. | 26221 |
16 |
| MacDermid Enthone Inc. | 238 |
16 |
| Other owners | 773 |