- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
Patent holdings for IPC class H01L 21/288
Total number of patents in this class: 1490
10-year publication summary
|
203
|
171
|
156
|
153
|
110
|
88
|
69
|
74
|
48
|
26
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42549 |
118 |
| Tokyo Electron Limited | 12681 |
84 |
| Lam Research Corporation | 5222 |
82 |
| Applied Materials, Inc. | 18565 |
63 |
| International Business Machines Corporation | 61198 |
36 |
| Ebara Corporation | 2166 |
31 |
| Mitsubishi Electric Corporation | 45998 |
28 |
| Novellus Systems, Inc. | 484 |
28 |
| Alchimer | 51 |
27 |
| FUJIFILM Corporation | 29329 |
26 |
| Atotech Deutschland GmbH | 556 |
26 |
| Texas Instruments Incorporated | 19479 |
24 |
| Infineon Technologies AG | 8218 |
22 |
| Semiconductor Components Industries, L.L.C. | 5255 |
21 |
| BASF SE | 20912 |
20 |
| Nikon Corporation | 7159 |
20 |
| Konica Minolta Holdings, Inc. | 929 |
18 |
| Samsung Electronics Co., Ltd. | 145630 |
17 |
| MacDermid Enthone Inc. | 238 |
16 |
| Micron Technology, Inc. | 26258 |
15 |
| Other owners | 768 |