- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/321 - After-treatment
Patent holdings for IPC class H01L 21/321
Total number of patents in this class: 2604
10-year publication summary
|
275
|
248
|
273
|
334
|
355
|
278
|
177
|
164
|
156
|
132
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43258 |
570 |
| Applied Materials, Inc. | 18861 |
210 |
| International Business Machines Corporation | 61433 |
96 |
| Samsung Electronics Co., Ltd. | 147501 |
87 |
| CMC Materials LLC | 250 |
66 |
| GLOBALFOUNDRIES U.S. Inc. | 6420 |
64 |
| United Microelectronics Corp. | 4244 |
61 |
| Tokyo Electron Limited | 12877 |
58 |
| Fujimi Incorporated | 742 |
58 |
| Versum Materials US, LLC | 648 |
51 |
| BASF SE | 20979 |
44 |
| FUJIFILM Electronic Materials U.S.A., Inc. | 331 |
41 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1761 |
38 |
| Micron Technology, Inc. | 26183 |
35 |
| Intel Corporation | 47143 |
32 |
| Lam Research Corporation | 5309 |
32 |
| DuPont Electronic Materials Holding, Inc. | 210 |
32 |
| Resonac Corporation | 2886 |
29 |
| Kioxia Corporation | 10387 |
27 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1033 |
25 |
| Other owners | 948 |