- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/324 - Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Patent holdings for IPC class H01L 21/324
Total number of patents in this class: 4105
10-year publication summary
|
629
|
592
|
522
|
449
|
465
|
213
|
170
|
167
|
166
|
170
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46161 |
550 |
| Applied Materials, Inc. | 19248 |
448 |
| International Business Machines Corporation | 61721 |
226 |
| Fuji Electric Co., Ltd. | 5253 |
108 |
| Tokyo Electron Limited | 13136 |
103 |
| Infineon Technologies AG | 8287 |
84 |
| Screen Holdings Co., Ltd. | 2932 |
80 |
| Kokusai Electric Corporation | 2103 |
68 |
| GLOBALFOUNDRIES U.S. Inc. | 6418 |
67 |
| United Microelectronics Corp. | 4307 |
66 |
| Texas Instruments Incorporated | 19495 |
62 |
| Samsung Electronics Co., Ltd. | 149087 |
58 |
| Lam Research Corporation | 5372 |
58 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10954 |
53 |
| Shin-Etsu Handotai Co., Ltd. | 1297 |
50 |
| Semiconductor Energy Laboratory Co., Ltd. | 11552 |
47 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1750 |
44 |
| Soitec | 1043 |
42 |
| Renesas Electronics Corporation | 5928 |
38 |
| Intel Corporation | 46460 |
34 |
| Other owners | 1819 |