- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
Patent holdings for IPC class H01L 21/68
Total number of patents in this class: 3327
10-year publication summary
|
177
|
248
|
285
|
312
|
320
|
293
|
291
|
239
|
289
|
7
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 17696 |
217 |
| Tokyo Electron Limited | 12090 |
206 |
| Nikon Corporation | 7128 |
175 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40539 |
150 |
| Lam Research Corporation | 4983 |
96 |
| Samsung Electronics Co., Ltd. | 138518 |
71 |
| Disco Corporation | 1810 |
53 |
| EV Group E. Thallner GmbH | 394 |
53 |
| Screen Holdings Co., Ltd. | 2636 |
52 |
| ASML Netherlands B.V. | 7130 |
49 |
| Samsung Display Co., Ltd. | 32700 |
37 |
| Boe Technology Group Co., Ltd. | 38777 |
32 |
| Semes Co., Ltd. | 1328 |
32 |
| KLA Corporation | 1398 |
32 |
| Brooks Automation US, LLC | 344 |
32 |
| Cowles Semi, LLC | 70 |
31 |
| Shanghai Micro Electronics Equipment (Group) Co., Ltd. | 251 |
30 |
| Kawasaki Heavy Industries, Limited | 1582 |
27 |
| Canon Inc. | 38071 |
25 |
| ASM IP Holding B.V. | 1877 |
24 |
| Other owners | 1903 |