- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
Patent holdings for IPC class H01L 21/68
Total number of patents in this class: 3487
10-year publication summary
|
177
|
248
|
285
|
311
|
320
|
293
|
301
|
254
|
291
|
191
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 18706 |
234 |
| Tokyo Electron Limited | 12751 |
225 |
| Nikon Corporation | 7173 |
175 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42863 |
155 |
| Lam Research Corporation | 5259 |
101 |
| Samsung Electronics Co., Ltd. | 146534 |
81 |
| Screen Holdings Co., Ltd. | 2831 |
68 |
| EV Group E. Thallner GmbH | 406 |
54 |
| Disco Corporation | 1864 |
52 |
| ASML Netherlands B.V. | 7394 |
51 |
| Samsung Display Co., Ltd. | 34842 |
41 |
| Semes Co., Ltd. | 1511 |
40 |
| KLA Corporation | 1561 |
36 |
| Boe Technology Group Co., Ltd. | 41267 |
33 |
| Canon Inc. | 40015 |
32 |
| Brooks Automation US, LLC | 348 |
31 |
| Cowles Semi, LLC | 70 |
31 |
| Shanghai Micro Electronics Equipment (Group) Co., Ltd. | 252 |
30 |
| Kawasaki Heavy Industries, Limited | 1633 |
27 |
| ASM IP Holding B.V. | 2080 |
27 |
| Other owners | 1963 |