- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
Patent holdings for IPC class B24B 37/04
Total number of patents in this class: 1660
10-year publication summary
|
107
|
116
|
144
|
124
|
128
|
106
|
119
|
138
|
133
|
87
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20406 |
213 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48438 |
149 |
| Ebara Corporation | 2329 |
140 |
| Fujimi Incorporated | 802 |
77 |
| Resonac Corporation | 3546 |
56 |
| CMC Materials LLC | 244 |
46 |
| Samsung Electronics Co., Ltd. | 157946 |
41 |
| Sumco Corporation | 1109 |
37 |
| Entegris, Inc. | 2007 |
31 |
| Shin-Etsu Handotai Co., Ltd. | 1306 |
31 |
| DuPont Electronic Materials Holding, Inc. | 202 |
28 |
| Disco Corporation | 1956 |
26 |
| Versum Materials US, LLC | 677 |
25 |
| 3m Innovative Properties Company | 17481 |
24 |
| Seagate Technology LLC | 3958 |
23 |
| Kioxia Corporation | 10823 |
17 |
| FUJIFILM Electronic Materials U.S.A., Inc. | 345 |
14 |
| Hitachi Chemical Company, Ltd. | 2241 |
13 |
| Siltronic AG | 434 |
13 |
| Tokyo Electron Limited | 13824 |
12 |
| Other owners | 644 |