- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
Patent holdings for IPC class B24B 37/04
Total number of patents in this class: 1569
10-year publication summary
|
101
|
107
|
116
|
144
|
124
|
126
|
105
|
113
|
131
|
128
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 19248 |
194 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46161 |
144 |
| Ebara Corporation | 2223 |
137 |
| Fujimi Incorporated | 765 |
75 |
| Resonac Corporation | 3004 |
51 |
| CMC Materials LLC | 248 |
46 |
| Samsung Electronics Co., Ltd. | 149087 |
37 |
| Sumco Corporation | 1115 |
34 |
| Shin-Etsu Handotai Co., Ltd. | 1297 |
31 |
| DuPont Electronic Materials Holding, Inc. | 208 |
28 |
| 3m Innovative Properties Company | 17730 |
25 |
| Seagate Technology LLC | 3978 |
23 |
| Versum Materials US, LLC | 656 |
23 |
| Disco Corporation | 1900 |
21 |
| Kioxia Corporation | 10452 |
16 |
| Hitachi Chemical Company, Ltd. | 2317 |
14 |
| Entegris, Inc. | 1908 |
14 |
| Siltronic AG | 424 |
13 |
| Tokyo Electron Limited | 13136 |
12 |
| Shin-Etsu Chemical Co., Ltd. | 5784 |
12 |
| Other owners | 619 |