- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
Patent holdings for IPC class B24B 37/04
Total number of patents in this class: 1579
10-year publication summary
|
107
|
116
|
144
|
124
|
126
|
106
|
113
|
132
|
133
|
4
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 19391 |
196 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46308 |
144 |
| Ebara Corporation | 2243 |
139 |
| Fujimi Incorporated | 767 |
75 |
| Resonac Corporation | 3040 |
52 |
| CMC Materials LLC | 247 |
46 |
| Samsung Electronics Co., Ltd. | 149838 |
38 |
| Sumco Corporation | 1119 |
35 |
| Shin-Etsu Handotai Co., Ltd. | 1295 |
31 |
| DuPont Electronic Materials Holding, Inc. | 209 |
28 |
| 3m Innovative Properties Company | 17604 |
25 |
| Seagate Technology LLC | 3984 |
23 |
| Versum Materials US, LLC | 656 |
23 |
| Disco Corporation | 1910 |
21 |
| Kioxia Corporation | 10479 |
16 |
| Entegris, Inc. | 1924 |
15 |
| Hitachi Chemical Company, Ltd. | 2311 |
14 |
| Siltronic AG | 426 |
13 |
| Tokyo Electron Limited | 13207 |
12 |
| Shin-Etsu Chemical Co., Ltd. | 5823 |
12 |
| Other owners | 621 |