- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/12 - Lapping plates for working plane surfaces
Patent holdings for IPC class B24B 37/12
Total number of patents in this class: 93
10-year publication summary
0
|
4
|
10
|
7
|
11
|
9
|
10
|
11
|
10
|
9
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Ebara Corporation | 2188 |
19 |
Applied Materials, Inc. | 18892 |
9 |
Shin-Etsu Handotai Co., Ltd. | 1283 |
9 |
Sumco Corporation | 1115 |
9 |
Seagate Technology LLC | 3970 |
6 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 43400 |
4 |
Fujikoshi Machinery Corp. | 54 |
3 |
Fujibo Holdings, Inc. | 104 |
2 |
Kureha Corporation | 1033 |
2 |
Maruishi Sangyo Co., Ltd. | 10 |
2 |
Samsung Electronics Co., Ltd. | 147622 |
1 |
Intel Corporation | 47129 |
1 |
Texas Instruments Incorporated | 19445 |
1 |
Denso Corporation | 24480 |
1 |
ASML Netherlands B.V. | 7441 |
1 |
Showa Denko K.K. | 2200 |
1 |
University of Florida Research Foundation, Inc. | 4048 |
1 |
Concria Oy | 13 |
1 |
Fujicopian Co., Ltd. | 36 |
1 |
Fujimi Incorporated | 743 |
1 |
Other owners | 18 |